Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress

An, Jun Eon; Park, Usung; Jung, Dong Geon; Park, Chihyun; Kong, Seong Ho

doi:10.3390/s19183979

Cited by 8 publications

(4 citation statements)

References 29 publications

(32 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The temperature drift suppression is significant for high-performance inertial navigation application in order to achieve excellent bias and scale factor stability. Several sensor structure and package designs have been reported to achieve high thermal stability and low sensitivity to thermal stress, such as location optimization of the bonding anchors [13], passive substrate temperature compensation [14], thermal stress isolation frame-based single anchor structures [15,16], and temperature-insensitive dieattach substrate with pillars [17]. Although a fully differential design of the MRA geometry can significantly mitigate the effects of temperature drift, there remains a residual drift due to imperfect fabrication and packaging.…”

Section: Introductionmentioning

confidence: 99%

Temperature compensation of MEMS resonant accelerometers with an on-chip platinum film thermometer

Wang

et al. 2023

J. Micromech. Microeng.

View full text Add to dashboard Cite

Temperature-dominated drift is generally the main error source for high-performance micromachined resonant accelerometers (MRAs) due to inherent thermal stress effect of resonator structure and die-attach process. This paper describes a design and experimental evaluation of a temperature compensation scheme for MEMS resonant accelerometers that demonstrates excellent bias and scale factor stability against temperature variation. An on-chip temperature sensor fabricated by sputtering platinum film on glass substrate is proposed to accurately sense the temperature-induced frequency change of the resonator. Post-compensation algorithm is used to suppress the temperature sensitivity of the MRA over dynamic temperature environment. The temperature drift test and compensation of four MEMS accelerometers with navigation-grade performance in a range from -40 to 60 °C show that the stability of bias and scale factor has been improved greatly. Temperature compensation results with a polynomial fitting model and a convolutional neural network (CNN) model are presented and compared to suppress the temperature drift hysteresis in consecutive temperature-varying tests. These experimental results indicate that this resonant accelerometer exhibits excellent temperature stability after compensation, which offers the promise for high-performance inertial navigation applications.

show abstract

Section: Introductionmentioning

confidence: 99%

Temperature compensation of MEMS resonant accelerometers with an on-chip platinum film thermometer

Wang

et al. 2023

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…Concerning the zero-level packaging, the capping near the device may generate significant stresses depending on the sealing and cap materials. Similarly, the BCB thin-film cap zero-level packaging can also have unwanted effects on the MEMS devices due to stress development resulting in package cap deformation and device chip deformation [13]. The principal source of this stress is the BCB cap's residual stress developed at the bonding step, mainly due to the Micromachines 2023, 14, 1312 2 of 12 thermal expansion coefficient difference between BCB and the device materials.…”

Section: Introductionmentioning

confidence: 99%

FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

Seok

2023

Micromachines

View full text Add to dashboard Cite

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change. Direct buckling simulation is recently reported as an easy and useful numerical wrinkling simulation method. A novel 3D FEM model of a thin-film package suitable for direct 3D buckling simulation is built to reduce the mode mixture between different buckling modes. Buckling modes of the packaging cap are investigated in terms of elastic moduli of package materials and applied strain due to thermal expansion coefficient difference. Based on the simulation results, it is found that there are two main modes in the fabricated thin-film buckling package determining the shape of the transferred thin-film packaging cover depending on the elasticity ratio between the cap and sealing ring materials. The mode shift from wrinkling cap mode to out-of-plane cap mode due to applied strain along a polymeric sealing ring is found.

show abstract

“…Generally, both the resolution and the uniformity of the adhesive dot substantially influence the characteristics of MEMS devices. 5,6 Nowadays, the growth of miniaturization is placing a higher demand on the volume resolution of the high-viscous droplet from nL to pL, urgently calling for a more efficient dispensing method. 7 Generally, the tube-based injection is extensively used to dispense droplets, and yet, the minimum size of the dispensed droplet is limited to 1−3 times that of the inner diameter of the nozzle.…”

Section: ■ Introductionmentioning

confidence: 99%

“…Especially, in the fabrication of microelectromechanical systems (MEMS) and microelectronic devices, some nanoliter-sized high-viscous liquids such as epoxy-based adhesive are widely utilized for multipart assembly, encapsulation, etc. − For example, in microaccelerometer assembly, the mass block is connected to the resonator by an adhesive dot of 300 μm in size. Generally, both the resolution and the uniformity of the adhesive dot substantially influence the characteristics of MEMS devices. , Nowadays, the growth of miniaturization is placing a higher demand on the volume resolution of the high-viscous droplet from nL to pL, urgently calling for a more efficient dispensing method …”

Section: Introductionmentioning

confidence: 99%

Loading a High-Viscous Droplet via the Cone-Shaped Liquid Bridge Induced by an Electrostatic Force

Wang

et al. 2021

Langmuir

View full text Add to dashboard Cite

In transfer printing, the loaded droplet on the probe has a significant influence on the dispensing resolution. A suitable loading approach for a high-viscous liquid is highly required. Herein, a novel electrostatic loading method is presented, in which the main aim is to control precisely the formation and breaking of a cone-shaped liquid bridge. An experimental device is developed. The influence of electrical and geometric parameters on the feature size of the liquid bridge is investigated in detail. In the formation of the liquid bridge, the increase of voltage or the decrease of the air gap can enhance the electric field intensity, thus reducing the formation period and increasing the initial cone tip diameter of the liquid cone. After the liquid bridge is formed, both the circuit current implying the liquid wetted area on the probe surface and the lifting velocity of the probe are utilized to further regulate the volume of the loaded droplet. Loaded droplets ranging from 60 to 600 pL are obtained via the method with a standard deviation of 4 to 30 pL. Moreover, a dot array is transferred with different loaded droplets. The minimum diameter of the printed dots is about 140 μm with a variation less than 5%. The advantages include the reduced risk of contamination, the droplet-size independent of the size of the probe, and the low cost of the device.

show abstract

Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress

Cited by 8 publications

References 29 publications

Temperature compensation of MEMS resonant accelerometers with an on-chip platinum film thermometer

Temperature compensation of MEMS resonant accelerometers with an on-chip platinum film thermometer

FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

Loading a High-Viscous Droplet via the Cone-Shaped Liquid Bridge Induced by an Electrostatic Force

Contact Info

Product

Resources

About