Die-Attach Materials for Extreme Conditions and Harsh Environments

Shen, Zhenxing; Fanini, Otto

doi:10.1007/978-3-319-99256-3_10

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2021

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“…It would not be possible to identify the most modern electronic devices without conductive adhesives. It is an inherently clean and convenient solution for solders in high-density electrical connections [ 19 ]. TCAs are applied in particular tasks in electronics industries like die attachment process in LED packaging, PCB fabrication, advanced thermally conductive composites production, chip-scale packages, and power semiconductors.…”

Section: Introductionmentioning

confidence: 99%

Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

et al. 2021

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The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.

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Section: Introductionmentioning

confidence: 99%