Dicing of hard and brittle materials with on-machine laser-dressed metal-bonded diamond blades

Witzendorff, Philipp von; Stompe, Manuel; Moalem, Anas; Cvetković, Srecko; Suttmann, Oliver; Overmeyer, Ludger; Rissing, Lutz

doi:10.1016/j.precisioneng.2013.08.007

Cited by 34 publications

(4 citation statements)

References 11 publications

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“…Conventional sapphire processing methods include mechanical cutting using diamond tools. However, since sapphire has high hardness, tool wear and micro cracks generated on the processed surface are identified as challenges [1]. Furthermore, in recent years, environmentally friendly machining is preferred; therefore, chips generated during machining, cutting cost, and working fluid required for machining pose additional problems.…”

Section: Introductionmentioning

confidence: 99%

Study on High Quality Thermal Stress Cleavage of Thick Sapphire Wafer

Kawabe

Furumoto

Koyano

et al. 2019

KEM

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This study deals with high quality thermal stress cleavage of thick sapphire wafer with thickness of 5 mm. The influence of the distance from the edge to the initial crack, laser power, and plane orientation on the cleavage characteristics was experimentally investigated. The results indicate that the surface waviness Wa at the cleaved surface was influenced by the distance from the edge. A cleaved surface with good surface characteristics was obtained by cleaving with low laser power. The cleavage direction also affects the cleaved surface characteristics.

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Section: Introductionmentioning

confidence: 99%

Study on High Quality Thermal Stress Cleavage of Thick Sapphire Wafer

Kawabe

Furumoto

Koyano

et al. 2019

KEM

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“…Hard-brittle materials, such as quartz glass, SiC, silicon, GaN, sapphire and alumina ceramics, are widely used in various micro-electromechanical systems (MEMS) with the particular application to integrated circuitry (IC), camera windows, infrared (IR) filter devices and electromechanical components. 1–5 For these applications, brittle material wafers should be sliced into miniature and micro-components or parts often with complex microstructures or features. 6–9 Besides laser cutting and electrochemical micromachining, mechanical precision machining with dicing blades is well suited for fabrication of complex microstructures and miniature components/parts while with enhanced functionality.…”

Section: Introductionmentioning

confidence: 99%

“…Electroplated nickel bond diamond blades are manufactured mostly by electroplated nickel technology in most circumstances. 1,11,16 Furthermore, TiC whisker enhancement, abrasive grain sizes and laser dressing are investigated to improve the cutting performance of dicing blade. 17–19 Basically, the quality of kerf depends on the combination of the material on work and parameters of the cutting process, cooling system, feed speed, type of blade and peripheral speed.…”

Section: Introductionmentioning

confidence: 99%

Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers

Yuan

Cheng

Zhang

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part B:

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Hard-brittle materials applied in various micro-electromechanical systems should be sliced into miniature and microparts often with complex microstructures. However, it is difficult for bladed dicing to machine those materials without damage because of their hard and brittle properties. This article presents innovative design and fabrication of dicing blades and the associated dicing process optimization, particularly by focusing on the blade wheel fabrication through sintering methods including traditional hot press sintering, vacuum sintering and spark plasma sintering. Four key parameters, namely, the radial wear of the dicing blade, the current of relay, the number of chips larger than 50 μm and the largest chip size, are employed to assess the cutting performance of dicing blades fabricated. The analysis and experimental results indicate that the spark plasma sintering method achieves the lowest number of chips and the smallest chip size due to its rapid spark between metal particles during the sintering process. The spark plasma sintering method can also produce a granular microstructure with sufficient porosities, which results in uniform bonding strength of diamond abrasive grits within the dicing blade. For the dicing process parameters, the back cutting depth has the most obvious influence on the dicing blade tool life, cutting current and slicing damages, while the feed rate is ranked the next. The least influencing parameter is the dicing spindle rotational speed.

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“…However, after more than 20 years of development, laser dressing remains in the experimental stage, and the number of researchers and published results in this field are limited. Based on statistics compiled by our group (from searching the Web of Science database), only 15 research organizations in six countries (India [1][2][3][4], Germany [5][6][7], China [8][9][10], USA [11][12][13], Switzerland [14][15][16], and Iran [17]) have been developed, and approximately 30 SCI publications on laser dressing have been published (including auxiliary laser dressing).…”

Section: Introductionmentioning

confidence: 99%

The grinding performance of a laser-dressed bronze-bonded diamond grinding wheel

Deng

2016

Int J Adv Manuf Technol

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Coarse-grained bronze-bonded diamond grinding wheels dressed using lasers and silicon carbide dressing wheels were used to grind YG8-cemented carbide workpieces. The wear patterns and grinding ratios of the laser-dressed grinding wheels were investigated after different grinding stages. After grinding, the laser-dressed grinding wheel displayed superior surface topography compared to the silicon carbide wheel, and the surface quality of the workpiece also improved. The minimum surface roughness of the workpiece was 0.425 μm. In the initial wear regime, the primary mechanisms included abrasive wear and grain removal. The grinding ratio was approximately 205.4, and the surface roughness of the workpiece after grinding was 0.314 μm. In the steady-state wear regime, abrasive wear was the primary mechanism of wearing, while minor amounts of grain removal and bond wear were observed. The grinding ratio was approximately 405.1, and the surface roughness was 0.337 μm. In the accelerated wear regime, the primary mechanisms were grain removal, abrasive wear, and bond wear. The grinding ratio was approximately 96.0, and the surface roughness was 0.454 μm.

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Dicing of hard and brittle materials with on-machine laser-dressed metal-bonded diamond blades

Cited by 34 publications

References 11 publications

Study on High Quality Thermal Stress Cleavage of Thick Sapphire Wafer

Study on High Quality Thermal Stress Cleavage of Thick Sapphire Wafer

Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers

The grinding performance of a laser-dressed bronze-bonded diamond grinding wheel

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