“…In direct roller mold processing, the seamless pattern can be formed on the cylindrical surface of the roller through direct laser writing, electron beam writing, 31 etching, 32 electroforming, 31,33 lateral silicon oxidation, 34 chemical vapour deposition (CVD) 35 or diamond blade writing. 36 As shown in Fig. 2b, the UV laser hybrid lithography direct writing system combining interference, projection, and immersion operating modes can write complex micro-nano structures (100 nm to 10 μm) on 65-inch substrates.…”