1990
DOI: 10.1007/bf00581110
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Diamond deposition on cemented carbide by chemical vapour deposition using a tantalum filament

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Cited by 42 publications
(10 citation statements)
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“…Therefore, using an average z cd Z 1000 1200 1400 1600 Raman shift (cm -' ) pressure coefficient of 2.5 cm -' GPa ', it is possible to estimate a 2 GPa residual compressive stress in the deposited diamond originating from the different thermal expansion coefficients of diamond and cemented tungsten carbide. This value is in good agreement with the residual thermal stress (crtherma) which can be calculated according to the following relationship [1] where adia = 3.15 X 10-6 K-' is the average thermal expansion coefficient of diamond in the 130 to 930°C temperature range, aub = 5.5 x 10 -6 K -' is the average thermal expansion coefficient of ISO-grade K10 cemented carbide in the 20 to 800°C temperature range, AT is the difference between substrate temperature during CVD and room temperature, Edi,, is the Young's modulus of diamond (1 TPa), and v is the Poisson ratio of the film (0.07). By using Eq.…”
Section: Resultssupporting
confidence: 80%
“…Therefore, using an average z cd Z 1000 1200 1400 1600 Raman shift (cm -' ) pressure coefficient of 2.5 cm -' GPa ', it is possible to estimate a 2 GPa residual compressive stress in the deposited diamond originating from the different thermal expansion coefficients of diamond and cemented tungsten carbide. This value is in good agreement with the residual thermal stress (crtherma) which can be calculated according to the following relationship [1] where adia = 3.15 X 10-6 K-' is the average thermal expansion coefficient of diamond in the 130 to 930°C temperature range, aub = 5.5 x 10 -6 K -' is the average thermal expansion coefficient of ISO-grade K10 cemented carbide in the 20 to 800°C temperature range, AT is the difference between substrate temperature during CVD and room temperature, Edi,, is the Young's modulus of diamond (1 TPa), and v is the Poisson ratio of the film (0.07). By using Eq.…”
Section: Resultssupporting
confidence: 80%
“…The W found in the top layer in this RBS measurement originates from the filaments, possibly due to high base pressure and/or the aggressive nature of the atomic hydrogen during the anneal and CNT deposition. Heated W wires are known to carburize during CVD processes and form WC and W 2 C phases [24][25][26][27], to determine how and in what form in our CVD process this W or WC x is deposited in the top layer additional experiments are needed.…”
Section: Resultsmentioning
confidence: 99%
“…1a shows the XRD pattern of a typical carbonized Ta catalyst, and only TaC (JCPSD Card No. 65-8795) peaks are observed, which indicates the TaC surface layer is thick enough to cover the whole wire [20,32]. The catalyst exhibits a yellow color corresponding to TaC, as presented in the inset.…”
Section: Characterization Of Si Films and Catalystsmentioning
confidence: 94%
“…EDX analysis confirms the catalyst core is pure Ta (not shown here). The shell layer has a uniform thickness of about 22 μm, which is suggested to be composed of TaC and Ta 2 C annularly [32][33][34], and the Ta 2 C is not identified by the direct XRD characterization for its existence in the inner side of the carbide layer. Fig.…”
Section: Characterization Of Si Films and Catalystsmentioning
confidence: 99%