“…For many years, the plasma polymerization process for thin‐film deposition has been the subject of intensive research efforts. This is because plasma polymerization has advantages in providing good adhesion to the substrate and pin‐hole‐free, mechanical, and chemical stability to the films 1–18. In these plasma polymerization processes, the variation of external discharge parameters, such as the pressure, flow rate, and effective power for both the continuous and pulsed modes, are used to control the surface properties of the films 2–6.…”