Device Photolithography: The Primary Pattern Generator Part II-Mechanical Design

Kossyk, G. J. W.; Laico, J. P.; Rongved, L.; Stafford, Jason

doi:10.1002/j.1538-7305.1970.tb02511.x

Cited by 5 publications

(7 citation statements)

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“…This image misalignment is converted to a feature misalignment tolerance on the photomask through the optical magnification of the microscope to give, (11) Scanning the mask on a stage through successive fields of view under a microscope is accomplished most rapidly by accelerating the stage through a distance approximately one half the edge dimension of the field of view and decelerating the stage through the remaining distance to the next field of view so that it stops precisely positioned. The stage may be designed so that the natural frequency of the table moving as a rigid body on its ways as a result of elastic deformation is tuned to the applied torque of the motor and time of traverse [7]. When this tuning is accomplished, the stage vibration is negligible when the table stops [7,8].…”

Section: Tv-microscope Methodsmentioning

confidence: 99%

“…The stage may be designed so that the natural frequency of the table moving as a rigid body on its ways as a result of elastic deformation is tuned to the applied torque of the motor and time of traverse [7]. When this tuning is accomplished, the stage vibration is negligible when the table stops [7,8].…”

Section: Tv-microscope Methodsmentioning

confidence: 99%

“…Values for this alignment tolerance are obtained by realizing that the total misalignment must produce exposures less than those produced by minimum detectable defects. Such exposures will be obtained if the misalignments Ax and Ay of two edges in each of these directions are no greater than q/2, or Ax = Ay < ±q/2 = ±1 ym (7) Misalignment can also result from a lack of consistency in line widths on different die patterns and yaws in the stage motion of the inspecting stage.…”

Section: S Dmentioning

confidence: 99%

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Automated photomask inspection

Novotny¹,

Ciarlo²

1978

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Methods that may be suitable for automated photomask inspection for visual defects (spots, pinholes, etc.) or dimensional compliance are analyzed and discussed. The analysis of each method includes examinations of the physical principles upon which it is based and the amount of misalignment that can be tolerated. The size of the minimum visual defect to be detected was taken as 2 ym. The methods analyzed for visual defect inspection are the optical-overlay; the dual-beam, flyingspot-scanner; the TV-microscope; and the spatial-filtering methods. For dimensional inspection, an analysis of line-edge location and operating criteria for the microdensitometer are presented. The fabrication of photomasks with intentionally introduced and controlled defects is described together with preliminary results of automated inspections of these photomasks. It was concluded that: automated inspection systems should be dedicated either to inspection for visual defects or dimensional compliance, not both; and the dimensional tolerances on masks, both those of the feature dimensions in the die patterns as well as those in the dimensions between the dice, must be significantly smaller than the size of the minimum defect to be detected.

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Section: Tv-microscope Methodsmentioning

confidence: 99%

Section: Tv-microscope Methodsmentioning

confidence: 99%

Section: S Dmentioning

confidence: 99%

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Automated photomask inspection

Novotny¹,

Ciarlo²

1978

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“…37-39, and 400-12, pp. [29][30] was extended to include the force at the tool tip during the bonding operation. This force, F(f ,t) is related to the third spatial derivative of the vibration amplitude at the tool tip by…”

Section: In-process Bond Monitormentioning

confidence: 99%

“…Capacitance-time characteristics for an MOS capacitor on a thin epitaxial layer when voltage breakdown occurs at voltages lower than the bias voltage which corresponds to the depletion edge at the layer substrate interface 40 29.…”

mentioning

confidence: 99%