2003
DOI: 10.1002/0470863803
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Device Modeling for Analog and RF CMOS Circuit Design

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Cited by 136 publications
(73 citation statements)
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“…and the dielectric capacitance per unit area c a both containing the dielectric capacitance C diel , and V th ¼ kT/q being the thermal voltage, V T the threshold voltage and V the gate voltage 34 . Despite the known differences in operational details between MOSFETs and OTFTs 35 , we can still expect the current in our OTFT device to depend superlinearly on the dielectric capacitance if operated in the subthreshold regime, which matches our experimental observation.…”
Section: Resultsmentioning
confidence: 99%
“…and the dielectric capacitance per unit area c a both containing the dielectric capacitance C diel , and V th ¼ kT/q being the thermal voltage, V T the threshold voltage and V the gate voltage 34 . Despite the known differences in operational details between MOSFETs and OTFTs 35 , we can still expect the current in our OTFT device to depend superlinearly on the dielectric capacitance if operated in the subthreshold regime, which matches our experimental observation.…”
Section: Resultsmentioning
confidence: 99%
“…The modeling results are compared with measured data and the maximal relative model error of divider ratio is less than 1.1 %. The intrinsic MOSFET is modeled by the standard BSIM3v3 model described in [8,9,10,11].…”
Section: Discussionmentioning
confidence: 99%
“…Each resistor segment is modeled as R seg = R tot N seg 1 − 1 ratio norm ratio geom (9) where N seg is number of divider segments (excluding sense segment), R tot is total spiral divider resistance and is calculated as…”
Section: Divider Dynamical Modelingmentioning
confidence: 99%
“…Although, some of the electric fields called fringing fields go through the air instead of the dielectric and increases the apparent area of the plates which is proportional to the thickness of the dielectric. Since for a MIM capacitor, a thin oxide is used as its dielectric, it makes vertical dimension to be much less than the dimensions of its plates, this problem is usually neglected [47]. In order to decrease the pixel size and consequently increase the fill factor, MIM cap is put on top of the circuit part of a pixel.…”
Section: -4-1 Capacitormentioning
confidence: 99%