2015
DOI: 10.1117/12.2188161
|View full text |Cite
|
Sign up to set email alerts
|

Device characteristics of antenna-coupled metal-insulator-metal diodes (rectenna) using Al2O3, TiO2, and Cr2O3as insulator layer for energy harvesting applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2017
2017
2023
2023

Publication Types

Select...
4

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(3 citation statements)
references
References 4 publications
0
3
0
Order By: Relevance
“…Other oxides that have been considered for inclusion in MIM diodes include ZnO [81,82], V 2 O 5 [20,83], SiO 2 [84,85], Nb 2 O 5 [86,87], CuO [8], TiO 2 [69], Cr 2 O 3 [88], HfO 2 [89] and Sc 2 O 3 [90]. A simple process for fabricating planar-type MIM tunneling diodes using electron beam writing and a boiling water oxidation process has been proposed, achieving high diode sensitivity of −31 V −1 for Poly Si/PolySi [85] and −14.5 V −1 for PolySi/Au electrodes [84] but too high R 0 .…”
Section: Single Insulator Mim Diodesmentioning
confidence: 99%
See 1 more Smart Citation
“…Other oxides that have been considered for inclusion in MIM diodes include ZnO [81,82], V 2 O 5 [20,83], SiO 2 [84,85], Nb 2 O 5 [86,87], CuO [8], TiO 2 [69], Cr 2 O 3 [88], HfO 2 [89] and Sc 2 O 3 [90]. A simple process for fabricating planar-type MIM tunneling diodes using electron beam writing and a boiling water oxidation process has been proposed, achieving high diode sensitivity of −31 V −1 for Poly Si/PolySi [85] and −14.5 V −1 for PolySi/Au electrodes [84] but too high R 0 .…”
Section: Single Insulator Mim Diodesmentioning
confidence: 99%
“…The constraint of only growing a derivative oxide layer of the underlying polycrystalline metal can be resolved by directly depositing an insulator on the bottom metal electrode using different deposition techniques and thus facilitating the use of any type of bottom metal electrode irrespective of its native oxide formation properties. These deposition techniques include sputtering [14,17,20,27,28,45,51,59,74,80,83,90,97,98], electron beam evaporation [88] and atomic layer deposition [8,9,18,30,51,56,58,75,81,89,96,[99][100][101], as listed in Tables 2 and 3. Among these techniques, ALD offers the best quality oxides with low defect density, excellent conformality and uniformity.…”
Section: Permittivity and Scaling Issuesmentioning
confidence: 99%
“…MIM diodes are capable of rectification in the high frequency range due to a femtosecond quantum‐tunneling electron transport mechanism through the insulator, making them attractive for applications in solar rectennas, infrared detectors, and wireless power transmission . However, the insulator layer in the MIM stack, which plays a crucial role in determining the diode performance, is typically deposited using vacuum‐based methods, such as sputtering, anodic oxidation of sputtered films, electron beam deposition, and especially atomic layer deposition (ALD), which is commonly used due to its ability to deposit nanoscale films with high accuracy and uniformity. High‐throughput fabrication of MIM diodes is limited by slow deposition rates and the need for a vacuum environment.…”
Section: Introductionmentioning
confidence: 99%