Developments of TaN ALD Process for 3D Conformal Coatings

Brizé, Virginie; Prieur, Thomas; Violet, Perrine; Artaud, Laurent; Berthomé, G.; Blanquet, Elisabeth; Boichot, R.; Coindeau, S.; Doisneau, B.; Farcy, A.; Mantoux, A.; Nuta, Ioana; Pons, M.; Volpi, F.

doi:10.1002/cvde.201100045

Cited by 6 publications

(4 citation statements)

References 35 publications

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“…This low-temperature ALD process is achieved thanks to the use of a dihydrogen plasma as a reducing stage of N,N′-diisopropylacetamidinate copper(I), named hereafter CuAmd. However, the ALD technique remains complex and difficult to master at the industrial level, and always requires an expensive equipment (secondary vacuum level, complex mastering of injection of vapor phases in the reaction chamber) …”

Section: Introductionmentioning

confidence: 99%

“…However, the ALD technique remains complex and difficult to master at the industrial level, and always requires an expensive equipment (secondary vacuum level, complex mastering of injection of vapor phases in the reaction chamber). 12 To tackle these drawbacks, we present here a fully liquid implementation of an amidinate copper precursor as a response to thin films problems via the use of well controlled, colloidal metallic NPs. 13 In that aim, colloidal solutions of metal NPs may be considered as a reservoir of "metallic nano bricks", which can be deposited on a substrate and ultimately form an electrically conductive metal layer.…”

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confidence: 99%

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A Novel Method for the Metallization of 3D Silicon Induced by Metastable Copper Nanoparticles

Cure

Piettre

Sournia‐Saquet

et al. 2018

ACS Appl. Mater. Interfaces

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The development of efficient copper deposition processes in high-aspect-ratio silicon structures is still a key technological issue for the microelectronic industry. We describe here a new process for the deposition of copper thin films in three-dimensional (3D) structures induced by the decomposition of a copper amidinate precursor in solution under a moderate H pressure. The reduction of a metal precursor under soft conditions (3 bar, 110 °C) affords the preparation of a high-purity, conformal metallic layer. We unveil a novel deposition mechanism driven by colloidal copper nanoparticles (NPs) in solution that behave as a reservoir of metastable metallic NPs that eventually condense as a solid film on all immersed surfaces. The film growth process is characterized by time-resolved analyses of the NPs in the colloidal state (nuclear magnetic resonance NMR and UV-vis spectra) and of the NPs and metallic layer on substrates (transmission electron microscopy TEM, and scanning electron microscopy SEM). Major deposition stages of this process are proposed and the conformal metallization of 3D silicon substrates is successfully achieved. This method is transposable to other metallic layers such as silver or nickel.

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Section: Introductionmentioning

confidence: 99%

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confidence: 99%

A Novel Method for the Metallization of 3D Silicon Induced by Metastable Copper Nanoparticles

Cure

Piettre

Sournia‐Saquet

et al. 2018

ACS Appl. Mater. Interfaces

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“…In order to deposit thin layers of TaN using PDMAT, ALD experiments evidenced a cracking of this precursor in the ALD reactor [25].…”

Section: Assessment Of Pdmat Thermodynamic Data By Mass Spectrometrymentioning

confidence: 99%

Thermodynamics Simulations Applied to Gas-Solid Materials Fabrication Processes

Blanquet¹,

Nuta²

2012

Thermodynamics - Fundamentals and Its Application in Science

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“…The applications extend from planar‐type thin film deposition to pore‐size tuning, optical tuning, catalysis, Li‐ion batteries, and more. Currently, in addition to the traditional metal, oxide, semiconductor, and nitride thin layers, various thin films with special physical properties, such as up‐/down‐conversion luminescent properties, can also be obtained via the ALD procedure.…”

Section: Introductionmentioning

confidence: 99%

Modification and Resonance Tuning of Optical Microcavities by Atomic Layer Deposition

Wang

Huang

Mei

2014

Chemical Vapor Deposition

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Recently, enormous interest has been focused on the nanofabrication of optical micro-and nanocavities for applications in labon-a-chip and quantum optics. At the same time, the atomic layer deposition (ALD) process presents several advantages for the fabrication and modification of micro-and nanostructures because of its atomic level thickness fine-tuning and perfect coating conformability in three-dimensional (3D) structures. Hence, ALD technology has been directed into the field of optical microcavities for the tracking and tuning of their properties. In this short review, we will summarize recent progress in the application of ALD on optical microcavities. Firstly, we will briefly introduce ALD technology and emphasize its distinctive features when applied to optical microcavities. Then, various microcavities such as photonic crystals, opals, and tubular microcavities will be illustrated to demonstrate their development with the assistance of ALD technology. Such an influential manufacturing tool for optical devices could inspire numerous interesting applications, as concluded in the final part.

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Developments of TaN ALD Process for 3D Conformal Coatings

Cited by 6 publications

References 35 publications

A Novel Method for the Metallization of 3D Silicon Induced by Metastable Copper Nanoparticles

A Novel Method for the Metallization of 3D Silicon Induced by Metastable Copper Nanoparticles

Thermodynamics Simulations Applied to Gas-Solid Materials Fabrication Processes

Modification and Resonance Tuning of Optical Microcavities by Atomic Layer Deposition

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