Development Trends of Thermosetting Resins for Electronics

Ohno, Daisuke

doi:10.5104/jiep.24.428

Cited by 1 publication

(2 citation statements)

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“…Thus, the primary strategy for suppressing DF is undoubtedly to remove or reduce the highly polarized units from the polymer structures. However, in fact, these non-polar polymers have neither high T g nor low CTE [ 31 ], e.g., T g = 140 °C for ZEONEX ® (COP) [ 48 ] and 226 °C for PPE [ 50 ]. This again suggests the difficulty in achieving the goal of this study.…”

Section: Resultsmentioning

confidence: 99%

“…In addition to the above-mentioned molecular mobility, the polarity control of structural units in polymers is important for suppressing DF. Figure 6 shows the relationship between ε r and tan δ in the range of 1-20 GHz for common polymers and conventional PIs: (1) PTFE [48], (2) cyclo-olefin polymer (COP, ZEONOR ® ) [48], (3) polyethylene (PE) [49], (4) poly(2,6-dimethyl-1,4-phenylene ether) (PPE) [50], ( 5) poly(methyl methacrylate) (PMMA) [51], ( 6) poly(vinyl chloride) (PVC) [51,52], (7) polyarylate (PAr, bisphenol A/isophthaloyl chloride) [53], (8) liquid-crystalline polyester (LCP, Vecstar ® ) [54,55], (9) poly(ether sulfone) (PES) [56], (10) PI (s-BPDA/p-PDA), ( 11) PI (PMDA/4,4 ′ -ODA), ( 12) poly(ethylene terephthalate) (PET) [57], and (13) epoxy resin (EP, bisphenol A diglycidyl ether/4,4 ′ -diaminodiphenyl sulfone) [58]. A rough correlation is observed over the wide ranges of tan δ (0.0001-0.1) and ε r (2-4).…”

Section: Primary Factor For Controlling Dielectric Properties In the ...mentioning

confidence: 99%

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Poly(ester imide)s with Low Linear Coefficients of Thermal Expansion and Low Water Uptake (VII): A Strategy to Achieve Ultra-Low Dissipation Factors at 10 GHz

Hasegawa,

Fukuda,

Ishii

2024

Polymers

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In this study, a series of ester-linked tetracarboxylic dianhydrides (TCDAs) with 2,6-naphthalene-containing longitudinally extended structures consisting of different numbers of aromatic rings (NAr = 6–8) was synthesized to obtain novel modified polyimides, poly(ester imide)s (PEsIs). These TCDAs were fully compatible with the conventional manufacturing processes of conventional polyimide (PI) systems. As an example, the PEsI film obtained from the ester-linked TCDA (NAr = 8) and an ester-linked diamine achieved unprecedented outstanding dielectric properties without the support of fluorinated monomers, specifically an ultra-low dissipation factor (tan δ) of 0.00128 at a frequency of 10 GHz (50% RH and 23 °C), in addition to an extremely high glass transition temperature (Tg) of 365 °C, extremely low linear coefficient of thermal expansion (CTE) of 6.8 ppm K−1, suppressed water uptake (0.24%), requisite film ductility, and a low haze. Consequently, certain PEsI films developed in this study are promising candidates for heat-resistant dielectric substrates for use in 5G-compatible high-speed flexible printed circuit boards (FPCs). The chemical and physical factors denominating tan δ are also discussed.

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Section: Resultsmentioning

confidence: 99%