Development of wafer level NCF (non conductive film)

Nonaka, Takamasa; Fujimsru, K.; Asahi, Noboru; Kasumi, K.-i.; Matsumoto, Yu

doi:10.1109/ectc.2008.4550182

Cited by 11 publications

(2 citation statements)

References 6 publications

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“…Due to this problem, non-conductive film (NCF)-based bonding technology was suggested to secure the mass production capability and bonding reliability. [30,31] In NCF bonding, the NCF, which is several tens of μm-thick epoxy film, is put on the chip and pressed at an elevated temperature. Here, temperature control is crucial for removing the NCF residue of the joint under the reflow temperature and curing it at the solder melting point.…”

Section: Polymers In Bonding Systemmentioning

confidence: 99%

Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices

Park

Kang

Kim

et al. 2023

Adv Materials Technologies

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Hybrid bonding enables the commercialization of ultra‐fine pitch high‐density 3D packages. Cu/SiO2 hybrid bonding is the standard packing interface recently introduced in the industry. Here, the Cu/polymer hybrid bonding interface beyond Cu/SiO2 is proposed in order to have high compatibility for additional processes in the future. Ideally, polymers can provide excellent bonding strength and low permittivity, enabling high‐speed signal transmission with high reliability. To realize it, optimum polymer and additives selection and polymer bonding processing development are needed to get the desired packaging interface. Therefore, detailed materials and processing challenges are discussed to realize the successful Cu/polymer hybrid bonding. Then, the authors’ preliminary results are suggested to supplement the feasibility of the emerging bonding technology.

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Section: Polymers In Bonding Systemmentioning

confidence: 99%

Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices

Park

Kang

Kim

et al. 2023

Adv Materials Technologies

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“…Adhesive bonding is extensively used in fabrication and packaging of IC and MEMS due to prominent advantages against conventional direct and solder bonding techniques [1][2][3]. In this bonding technique, a polymer layer is applied as intermediate to bond two wafers together and thermosetting polymer is one of the most important intermediate materials [4][5]. During the process of polymer layer preparing (liquid-type polymer coating or film-type transferring), gas is often entrapped so that bubbles are formed.…”

Section: Introductionmentioning

confidence: 99%

Gas Bubble Behavior Model in Adhesive Bonding Using Thermosetting Polymer

Zhong

Zhang

2011

AMR

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Gas bubbles entrapped in polymer intermediate layer often lead to voids which are severe defects of adhesive bonding qualities. Although the empirical method had been used for a long time to eliminate the bubbles, theoretic analysis considering the bubble behavior during bonding process is more preferable because of the better universality. The interrelationships between processing parameters and bubble deformation were investigated. A theoretic model describing those interrelationships was developed reasonably using gas diffusion theory to predict the bubble behavior. The mathematic equations of this model were deduced and the solution was obtained with some proper simplifications. Experiments under different conditions were carried out and the experimental results were contrasted with the theoretical predictions. It was obvious that when choosing temperatures and pressures carefully, the model could predict the bubble behavior accurately.

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Wafer and/or chip bonding adhesives for 3D package

Nonaka

Fujimaru

Shimada

et al. 2010

2010 IEEE CPMT Symposium Japan

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For 3D package application the demanded feature of chip bonding adhesive was discussed and the material was developed, which was wafer level process compatible NCF (Non conductive sheet). It should be high flowability for lamination on a bumped wafer surface without void, diced with wafer without deformation or sticking dust, transparent for alignment mark detection and low coefficient of thermal expansion (CTE) for the package thermal cycle durability. The nano particle dispersed and highly loaded NCF has been developed to satisfy the demanded characteristics. The CTE was 37 o C/ppm and 1% weight loss temperature is higher than 350 o C.The photosensitive NCF has been also developed. Bump top adhesive can be removed completely by photolithography before bonding process. It can wipe off the anxiety of adhesive residue between bump and pad. This material is also good for lamination and has high heat resistance of 1% weight loss temperature higher than 300 o C.

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Development of wafer level NCF (non conductive film)

Cited by 11 publications

References 6 publications

Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices

Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices

Gas Bubble Behavior Model in Adhesive Bonding Using Thermosetting Polymer

Wafer and/or chip bonding adhesives for 3D package

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