Development of VCI (Vertical Circuit Interconnection) technology for stacked die package

Review of Electromagnetic failure, optimization techniques and stress prediction in Interconnect

“…Space Division Multiplexed Micro structured optical fiber bus Micro structured optical fiber bus low cross talk & low bend loss [24] Copper balls interconnection technology Reduce the package size [19] CNT Array as High Impedance Interconnects.…”

“…• The fabrication process is not cost competitive [15] Number of masking steps should be reduced Wire bond technology Increase the size of package body with respect to the number of dice stacked in the package [19] Optical interconnect…”

“…• The key processes of VCI technology are coating, laser ablation and conductive glue which have used after die attach, to replace traditional wire bonding technology [19].…”