2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2020
DOI: 10.1109/itherm45881.2020.9190513
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Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick

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(2 citation statements)
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“…Comparisons of the ∆P c •K values of the MWs and the CFMWs with other wick structures are shown in Figure 8 [16,[18][19][20][21][22][23][24][25][26][27][28][29]. The CFMWs superior capillary performance at an ultra-thin thickness, especially superior sintered meshes.…”
Section: The Capillary Performance Of Mws and Cfmwsmentioning
confidence: 97%
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“…Comparisons of the ∆P c •K values of the MWs and the CFMWs with other wick structures are shown in Figure 8 [16,[18][19][20][21][22][23][24][25][26][27][28][29]. The CFMWs superior capillary performance at an ultra-thin thickness, especially superior sintered meshes.…”
Section: The Capillary Performance Of Mws and Cfmwsmentioning
confidence: 97%
“…Figure 11. Comparison of the capillary limit Qmax,capillary of different wicks[18,19,[21][22][23]26,27,29].…”
mentioning
confidence: 99%