Development of Thin-Film Liquid-Crystal-Polymer Surface-Mount Packages for $Ka$-Band Applications

Aihara, Kunia; Chen, M.J.; Pham, Anh‐Vu

doi:10.1109/tmtt.2008.2002224

Cited by 32 publications

(4 citation statements)

References 16 publications

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“…In 2006, Thompson et al studied integrated GaAs in a low-noise amplifier (LNA) in multilayer LCP substrates and near-hermetic packaging in the mmW range [111]. In 2008, the surface-mounted integration and packaging of LNA in the Ka-band was reported, demonstrating a measured leak rate of as low as 3.6 × 10 −8 atm•cc/s [112]. Conformal inverse L-shaped monopole antenna integrated and packaged for WLAN/WiMax applications was reported at 5 GHz in 2009 [113], introducing a method for the direct integration of a large antenna element into a small module package.…”

Section: Chip Integration and Packgingmentioning

confidence: 99%

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Zhou

Qian

et al. 2022

Molecules

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With the emergence of fifth-generation (5G) cellular networks, millimeter-wave (mmW) and terahertz (THz) frequencies have attracted ever-growing interest for advanced wireless applications. The traditional printed circuit board materials have become uncompetitive at such high frequencies due to their high dielectric loss and large water absorption rates. As a promising high-frequency alternative, liquid crystal polymers (LCPs) have been widely investigated for use in circuit devices, chip integration, and module packaging over the last decade due to their low loss tangent up to 1.8 THz and good hermeticity. The previous review articles have summarized the chemical properties of LCP films, flexible LCP antennas, and LCP-based antenna-in-package and system-in-package technologies for 5G applications, although these articles did not discuss synthetic LCP technologies. In addition to wireless applications, the attractive mechanical, chemical, and thermal properties of LCP films enable interesting applications in micro-electro-mechanical systems (MEMS), biomedical electronics, and microfluidics, which have not been summarized to date. Here, a comprehensive review of flexible LCP technologies covering electric circuits, antennas, integration and packaging technologies, front-end modules, MEMS, biomedical devices, and microfluidics from microwave to THz frequencies is presented for the first time, which gives a broad introduction for those outside or just entering the field and provides perspective and breadth for those who are well established in the field.

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Section: Chip Integration and Packgingmentioning

confidence: 99%

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Zhou

Qian

et al. 2022

Molecules

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“…Although a strong bond could be produced the high interfacial stress after bonding caused wafer cracking in the dicing process. LCP as a near-hermetic material has also been studied for packaging RF-MEMS devices due to its excellent electrical properties such as low dielectric constant and loss [29], [30]. A hot water tube was used to bond a molded LCP lid to an LCP board both with a higher melting temperature using an LCP film with a lower melting temperature.…”

Section: Introductionmentioning

confidence: 99%

A Laser-Assisted Bonding Method Using a Liquid Crystal Polymer Film for MEMS and Sensor Packaging

Jiang

Wang

Liu

2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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In this paper, we present the development of a laser-based bonding method using a liquid crystal polymer (LCP) film for cavity-based packaging of sensors and Microelectromechanical systems (MEMS) devices. LCP films possess the best properties among polymeric materials in terms of moisture resistance and temperature stability. We show that high-quality bonding of silicon and glass substrates as well as encapsulation of molded LCP packages can be obtained using a laser-assisted bonding method. Shear and leak tests were carried out to demonstrate good quality of the laser-bonded microcavities and packages. In situ temperature monitoring was obtained by embedding a small temperature sensor just below the bonding interface of an LCP package. The average shear strength ranges from 20.8 to 26.1 MPa depending on the design configurations and bonding conditions. The results of the color liquid-based, and gross and fine leak-based tests show pin-hole-free bonding and good hermeticity. The results of the temperature monitoring work show the potential of the laserbased approach for low-cost packaging of temperature-sensitive devices in molded LCP packages. Index Terms-Laser joining, liquid crystal polymer (LCP) film, MEMS, packaging, sensors.2156-3950 © 2015 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.Changhai Wang (M'12) received the B.Sc. degree in semiconductor physics and devices from Jilin University, Changchun, China, in 1985, and the M.Sc. degree in optoelectronic and laser devices and the Ph.D. degree in low-power all-optical switching devices from Heriot-Watt University, Edinburgh, U.K., in 1988 and 1991, respectively. He is currently a Lecturer in Electrical and Electronic Engineering with the School of Engineering and Physical Sciences, Heriot-Watt University. His current research interests include fabrication and assembly of microstructures, MEMS devices and sensors, MEMS and 3-D packaging, and laser-assisted methods for MEMS and electronics manufacturing.Wei Liu received the B.Sc., M.Sc., and Ph.D. degrees in materials science and engineering from the Harbin Institute

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“…Recently, Liquid Crystal Polymer has been demonstrated for low-cost, light weight and compact near-hermetic packaging [1][2][3][4][5]. Organic materials are light weight, compatible with multi-layered integration, and typically lower cost than their counterpart ceramics and metal.…”

Section: Introductionmentioning

confidence: 99%

“…It consists of all LCP dielectric materials and has 4 metal layers. The fabrication of the LCP board has been described in [2]. Using the multi-layer structure, we have provided all of the DC routing and interconnect in the module.…”

Section: Introductionmentioning

confidence: 99%

Development of a Liquid Crystal Polymer Receiver Module at Ka-band for Space Applications

Pham¹,

Mamidanna²

2013

31st AIAA International Communications Satellite Systems Conference

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We present the design and development of a Liquid Crystal Polymer receiver module at Ka-band. Liquid crystal polymer (LCP), an emerging organic material, has permeation close to glass and can be used to construct near-hermetic cavities for housing monolithic microwave integrated circuits (MMICs). Using LCP, we have developed an integrated band-pass filter on the substrate. Furthermore, we have packaged a low noise amplifier (LNA) and a driver amplifier using chip-on-board with bond wires. We have developed a custom lamination process to seal a lid on the substrate to protect the MMICs.

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Development of Thin-Film Liquid-Crystal-Polymer Surface-Mount Packages for $Ka$-Band Applications

Cited by 32 publications

References 16 publications

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

A Laser-Assisted Bonding Method Using a Liquid Crystal Polymer Film for MEMS and Sensor Packaging

Development of a Liquid Crystal Polymer Receiver Module at Ka-band for Space Applications

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