Development of the conductivity type inversion caused by thermal double donors’ formation in p-type high-resistivity silicon

Abstract

The formation of thermal double donors (TDDs) during the iso-thermal annealing at 450 ℃ in low-oxygen and high-resistivity silicon was quantitatively investigated, and the oxygen related power parameter x for low-oxygen and high-resistivity silicon was obtained. Excessive TDDs formed in the p-type high-resistivity silicon during the devices manufacturing process will invert the conductivity to n-type. A quantitative relationship between the critical wafer start resistivity and oxygen concentration in p-type high-resistivity silicon was obtained, t. The p-type conductivity can be maintained after devices fabrication by controlling the resistivity below the critical resistivity corresponding to the oxygen concentration in p-type high-resistivity silicon.