1999
DOI: 10.1016/s0026-2714(98)00202-9
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Development of test vehicles for evaluating plastic-encapsulant reliability and improving thermal conductivity of encapsulant materials

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Cited by 5 publications
(4 citation statements)
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“…However, thermal insulation is not a strength of polymers, as their thermal conductivity is only 0.1 to 0.5 Wm −1 K −1 . It is possible to increase the thermal conductivity of a polymer by introducing fillers with a high thermal conductivity, such as aluminum oxide, aluminum nitride, boron nitride, silicon nitride, beryllium oxide, or diamond (Enlow et al 1999 ; Tanaka et al 2012 ).…”
Section: Materials Substitution As a Secondary Sourcementioning
confidence: 99%
“…However, thermal insulation is not a strength of polymers, as their thermal conductivity is only 0.1 to 0.5 Wm −1 K −1 . It is possible to increase the thermal conductivity of a polymer by introducing fillers with a high thermal conductivity, such as aluminum oxide, aluminum nitride, boron nitride, silicon nitride, beryllium oxide, or diamond (Enlow et al 1999 ; Tanaka et al 2012 ).…”
Section: Materials Substitution As a Secondary Sourcementioning
confidence: 99%
“…Advantages in availability, cost, weight, and market lead time have given plastics more than 97% of the worldwide chip packaging market. o ‐Cresol‐formaldehyde novolac epoxy (CNE) resins cured with cresol novolac hardeners (CNH), which have relatively low volumetric shrinkage upon polymerization, good thermal and dimensional stability, excellent moisture and chemical resistance, and superior electrical and mechanical properties, are often employed to encapsulate microelectronic devices 1–3. The trend toward greater integration and functionality in the die is driving the need for packages of high pin counts and good heat dissipating capability.…”
Section: Introductionmentioning
confidence: 99%
“…Among the common package reliability problems, moisture‐induced delamination and cracking of the package during reflow soldering are two major issues. Ninety percent of failures occur at the material–material interface because of moisture, temperature cycling, and contamination 1–3. A high level of stress is built up within the package as a result of the enhanced mismatch between the dissimilar materials in the package.…”
Section: Introductionmentioning
confidence: 99%
“…However, thermal insulation is not a strength of polymers, as their thermal conductivity is only 0.1 to 0.5 Wm − 1 K − 1 . It is possible to increase the thermal conductivity of a polymer by introducing llers with a high thermal conductivity, such as aluminium oxide, aluminium nitride, boron nitride, silicon nitride, beryllium oxide, or diamond(Enlow et al 1999;Tanaka et al 2012).…”
mentioning
confidence: 99%