2023
DOI: 10.1016/j.conbuildmat.2023.131040
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Development of soybean meal based adhesives with excellent wet-resistance and prepressing bonding strength via disulfide bond reshuffling strategy

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Cited by 11 publications
(5 citation statements)
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“…The sulfhydryl groups from two different cysteine residues can form a new chemical bond, named disulfide bond, which is conducive to stabilizing the structure of proteins . In high-temperature environments, the disulfide bonds are affected, thereby breaking the structure of proteins. , …”
Section: Resultsmentioning
confidence: 99%
“…The sulfhydryl groups from two different cysteine residues can form a new chemical bond, named disulfide bond, which is conducive to stabilizing the structure of proteins . In high-temperature environments, the disulfide bonds are affected, thereby breaking the structure of proteins. , …”
Section: Resultsmentioning
confidence: 99%
“…Figure b illustrates that after curing, the SP adhesive sample exhibited a significant enhancement in the C–N and N–H vibration peak at 1210 cm –1 , accompanied by a reduction in the area of the C–O stretching vibration peak at 1065 cm –1 . These changes suggest the occurrence of an amidation reaction . Additionally, the increased peak area at 1730 cm –1 indicates the generation of carbonyl during the esterification reaction .…”
Section: Chemical Structure Analysis Of Sp and Spc Adhesivesmentioning
confidence: 98%
“…These changes suggest the occurrence of an amidation reaction. 31 Additionally, the increased peak area at 1730 cm −1 indicates the generation of carbonyl during the esterification reaction. 32 An increase in the PAE ratio correlated with a rise in the carbonyl peak area (Figure 1c), reinforcing the earlier observation.…”
Section: ■ Chemical Structure Analysis Of Sp and Spc Adhesivesmentioning
confidence: 99%
“…8 However, SM contains large amounts of hydrophilic groups and abundant nutrients (proteins and polysaccharides), resulting in poor water resistance, low mechanical strength, and short storage life. Several modifications like protein denaturation, 9 chemical cross-linking, 10 biomimetic modification, and nanoenhancement 11 have been investigated to increase the waterproofing of SM glues. Enhancement of cross-link density by adding an epoxy cross-linker is the most common method to address the defects in the SM adhesive.…”
Section: Introductionmentioning
confidence: 99%