Development of solvent-free acrylic pressure-sensitive adhesives

Czech, Zbigniew; Wesołowska, Marta

doi:10.1016/j.eurpolymj.2007.05.003

Cited by 43 publications

(24 citation statements)

References 4 publications

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“…Such compounds cannot be detected using an FID, but can be detected using a universal conductivity detector (a katharometer TCD). A TCD is characterized by a considerably higher limit of detection (10 -7 -10 -8 g/cm 3 ). In such analysis, a capillary column and high-purity helium carrier gas are usually employed.…”

Section: Latest Scientific Achievements In Thermal Degradation Of Acrmentioning

confidence: 99%

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Thermal decomposition of acrylic pressure-sensitive adhesives

Czech

Pełech

Zych

2009

Polish Journal of Chemical Technology

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The general aim of this article is to review the state of knowledge on pressure-sensitive adhesives (PSAs) and pyrolysis. Recent research data in the field of pyrolysis gas-chromatography (Py-GC) analysis of acrylic PSAs are presented. First, PSA characteristics and applications, pyrolysis (including Py-GC) as an analytical method, and system solutions, are described. The latest scientific achievements in the analysis of thermal degradation products of acrylic PSAs are then presented.

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Section: Latest Scientific Achievements In Thermal Degradation Of Acrmentioning

confidence: 99%

“…An FID is characterized by a low limit of detection (10 -12 g/cm 3 ) and a wide range of linearity (10 7 ). The method is especially useful in the analysis of organic compounds, which are often components of a pyrolysate.…”

Section: Latest Scientific Achievements In Thermal Degradation Of Acrmentioning

confidence: 99%

Thermal decomposition of acrylic pressure-sensitive adhesives

Czech

Pełech

Zych

2009

Polish Journal of Chemical Technology

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“…The growing success of photocrosslinking technology in a wide variety of industrial products and processes can be attributed to the productivity and environmental benefits that result from such technologies. [1][2][3] UV technology is well established in the market and allows the production of a wide range of photocrosslinkable pressure-sensitive adhesives (PSA) with interesting features. The balance between adhesive and cohesive strengths within the crosslinked coatings is critical for the performance of UV crosslinked PSA.…”

Section: Introductionmentioning

confidence: 99%

Photocrosslinking of solvent-based acrylic pressure-sensitive adhesives (PSA) by the use of selected photoinitiators type I

Czech

Shao

Kowalczyk

et al. 2013

Journal of Adhesion Science and Technology

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This study investigated the photocrosslinking of solvent-based acrylic pressure-sensitive adhesives (PSA) containing selected photoinitiators type I, known as α-cleavage photoinitiators. Photocrosslinking of PSA, especially of acrylic PSA, is well established crosslinking process by using the UV radiation technology. UV-initiated crosslinking of acrylic PSA allows the synthesis of the wide range of UV-crosslinkable PSA with the interesting features. Especially, the important balances of properties such as adhesive and cohesive strength which are typically critical for the application performance can be achieved by this technology. The selection of suitable photoinitiator plays important role to obtaining the optimum properties of acrylic PSA including tack, peel adhesion and shear strength. In this study, the investigations on different saturated conventional photoinitiators of type I for solvent-based PSA were carried out. The effects of photoinitiator concentration, UV crosslinking time and UV dose on the tack, peel strength and shear strength were explored in detail for guiding the choice of photoinitiators to fabricate advanced PSA for industrial usage.

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“…Another novel curing acrylic PSAs method is ultraviolet (UV)‐curing technique. The UV‐curing system is popularly used in polymer applications, because it makes polymers have good physical properties such as hardness, gloss, heat resistance as well as water resistance . Beyond that, fast reaction rates and low energy consumption are also superior to those of traditional curing technologies .…”

Section: Introductionmentioning

confidence: 99%

Heat resistance of acrylic pressure‐sensitive adhesives based on commercial curing agents and UV/heat curing systems

Zhang

Yue

et al. 2018

J of Applied Polymer Sci

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The development of adhesive tapes that can be applied at high temperature is a major challenge for pressure‐sensitive adhesives (PSAs). To date, the heat resistance of PSAs has not been investigated in sufficient details. In this study, based on the relationship between curing structures and properties, a series of acrylic PSAs with excellent heat resistance were prepared. Commercial zirconium acetylacetonate (ZrACA), desmodur L75 (L75), and N,N,N′,N′‐tetrakis(2,3‐epoxypropyl)‐m‐xylene‐α,α′‐diamine (GA240) were employed as heat‐curing agents. Trimethylolpropane triacrylate (TMPTA) was used as ultraviolet (UV)‐curing agent to form semi‐interpenetration polymer network structures after UV exposure. The influences of different curing agents on the thermal stability, adhesion performance, gel fraction, and viscoelastic of PSAs were explored. The results showed that the PSAs cured by L75, GA240, and TMPTA exhibited excellent heat resistance. Especially, when the content of L75 was 1.0 wt %, the PSAs could be peeled off substrate without residues on substrate surface after treatment at 170 °C for 4 h, while the nonmodified acrylic PSAs possessed residues after treatment from 110 °C. The cured PSAs adhesive performance was evaluated showing maximum 180° peel strength of 16.7 N/25 mm comparable to current PSAs. These resulting PSAs showed high heat resistance and they are suitable for a broad range of special fields. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47310.

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Development of solvent-free acrylic pressure-sensitive adhesives

Cited by 43 publications

References 4 publications

Thermal decomposition of acrylic pressure-sensitive adhesives

Thermal decomposition of acrylic pressure-sensitive adhesives

Photocrosslinking of solvent-based acrylic pressure-sensitive adhesives (PSA) by the use of selected photoinitiators type I

Heat resistance of acrylic pressure‐sensitive adhesives based on commercial curing agents and UV/heat curing systems

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