Development of seed layer deposition and fast copper electroplating into deep microvias for three‐dimensional integration

Chen, Xiao; Xu, Gaowei; Li, Luo

doi:10.1049/mnl.2012.0801

Cited by 8 publications

(4 citation statements)

References 6 publications

(6 reference statements)

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“…Wafer-level packaging can encapsulate and protect the microstructure of the device prior to dicing as well as reduce the size and cost [40][41][42]. Moreover, vacuum packaging can be realized by vacuum bonding.…”

Section: Packagementioning

confidence: 99%

MEMS-based thermoelectric infrared sensors: A review

et al. 2017

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In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

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Section: Packagementioning

confidence: 99%

MEMS-based thermoelectric infrared sensors: A review

et al. 2017

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“…In this scale, the maximum area is about 10 µm lower than the bottom of the electrode. According to the deposition rate equation (1) in the electroplating process [32], if the current efficiency η(%) and the electrochemical equivalent (g/C) are constant, then the deposition rate of coating is proportional to the current density i(A m −2 ). That means a higher current density leads to a higher deposition rate of coating.…”

Section: Electroplating Process Simulation and Designmentioning

confidence: 99%

Fabrication of optimized streamlined micro nozzles by hybrid electrochemical techniques

Zhao

Zhang

et al. 2018

J. Micromech. Microeng.

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High printing accuracy is one of the development directions of inkjet printing technology. To achieve a higher printing accuracy, nozzles with a small diameter and specific shape or surface properties are required. The diameter of these nozzles is usually less than 50 µm, and the profile has developed from linear to streamline. Furthermore, the speed of the ink filling is improved by the hydrophilicity of the inner surface. Electrochemical machining (ECM) has the advantages of low surface roughness and fewer material limitations, and it is suitable for precision machining of microstructures. However, micro ECM is limited by the manufacture of tool electrodes; the electrode becomes more and more difficult to manufacture as the feature size decreased. To manufacture micro nozzles with a specific shape and hydrophilic surface, a hybrid electrochemical technique combining electrolysis and electroplating is proposed in this paper. Firstly an initial nozzle is electrolytically machined by a micro electrode with side wall insulation, then the direction of the electric field is reversed and the micro electrode is used as an auxiliary anode for electroplating. The profile of the nozzle is controlled by the different holding times and different feed depths of the auxiliary anode, and the surface properties are determined by the choice of electrolyte. The profile of the streamlined micro nozzle is optimized by simulation analysis with COMSOL Multiphysics®. A simulation model of the electroplating process is established, which verified the feasibility of diameter reduction and profile controlling of the nozzle. Experimental results show that a streamlined micro nozzle with an outlet diameter of 21 µm is manufactured with the assistance of a micro electrode with diameter of 130 µm. Furthermore, the feed depth of the micro electrode is optimized to improve the process efficiency of electroplating.

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“…Copper electrodeposition is the most important aspect for interconnect fabrication in state-of-the-art integrated circuit (IC) chips, IC packaging substrates and printed circuit boards (PCBs) because of the demands of electronic products with high-density interconnection, multi-function and high performance (Chen et al , 2014, 2013; Zhang et al , 2015a, 2015b). Increasing demands for electronic devices with superior performance and functionality while reducing their sizes and weights have driven the PCB industry to develop a more advanced manufacturing process.…”

Section: Introductionmentioning

confidence: 99%

Multi-physics coupling aid uniformity improvement in pattern plating

Wang

et al. 2016

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Purpose The uniformity of electrodeposition is the key to successful application of pattern plating because the quality of electrodeposited copper layer has a huge impact on the performance of printed circuit boards (PCBs). The multi-physics coupling technology was used to accurately analyze and forecast the characteristics of electrochemical system. Further, an optimized plating bath was used to achieve a uniform electrodeposition. Design/methodology/approach A multi-physics coupling numerical simulation based on the finite element method was used to optimize electrodeposition conditions in pattern plating process. The influences of geometric and electrochemical factors on uniformity of current distribution and electrodeposited layer thickness were discussed by multi-physics coupling. Findings The model results showed that the distance between cathode and anode and the insulating shield had a great impact on uniformity of electrodeposition. By numerical simulation, it had been proved that using an auxiliary cathode was an effective and simple way to improve uniformity of electrodeposition due to redistributing of the current. This helped to achieve more uniform surface of the copper patterns by preventing the edge effect and the roughness of the copper layer was reduced to 1 per cent in the secondary current distribution model. Research limitations/implications The research is still in progress with the development of high-performance computers. Practical implications A multi-physics coupling platform is an excellent tool for quickly and cheaply studying the process behaviors under a variety of operating conditions. Social implications The numerical simulation method has laid the foundation for the design and improvement of the plating bath. Originality/value By multi-physics coupling technology, we built a bridge between theoretical and experimental study for control of uniformity of pattern plating in PCB manufacturing. This method can help optimize the design of plating bath and uniformity of pattern plating in PCB manufacturing.

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Development of seed layer deposition and fast copper electroplating into deep microvias for three‐dimensional integration

Cited by 8 publications

References 6 publications

MEMS-based thermoelectric infrared sensors: A review

MEMS-based thermoelectric infrared sensors: A review

Fabrication of optimized streamlined micro nozzles by hybrid electrochemical techniques

Multi-physics coupling aid uniformity improvement in pattern plating

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