Development of second-level connection method for large-size CPU package

Baba, Shunji; Koide, Masateru; Watanabe, Manabu; Fukuzono, Kenji; Yamamoto, Tsuyoshi; Sakuyama, Seiki; Shimizu, Kozo; Okamoto, Keishiro; Mizutani, Daisuke

doi:10.1109/ectc.2014.6897269

Cited by 5 publications

(1 citation statement)

References 3 publications

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“…Although various criterions may lead to wide variation in results, packaging reliability tests with different criterions were found from the literatures and the industrial standards. For example, the failure criterions for direct current electrical reliability measurement used in a single conference included relative resistance change at 5% [1], 10% [2][3][4][5][6], 15% [7,8], 20% [3,[9][10][11], or a resistance threshold [12]. After reviewing typical TSV reliability paper, it was interesting to note that a large variety of criterions were used in the literatures [13][14][15][16][17][18][19][20][21].…”

Section: Introductionmentioning

confidence: 99%

A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

Lwo

Tseng

Tseng³

2016

Journal of Electronic Packaging

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Three-dimensional (3D) structure with through silicon via (TSV) technology is emerging as a key issue in microelectronic packaging industry, and electrical reliability has become one of the main technical subjects for the TSV designs. However, criteria used for TSV reliability tests have not been consistent in the literature, so that the criterion itself becomes a technical argument. To this end, this paper first performed several different reliability tests on the testing packaging with TSV chains, then statistically analyzed the experimental data with different failure criteria on resistance increasing, and finally constructed the Weibull failure curves with parameter extractions. After comparing the results, it is suggested that using different criteria may lead to the same failure mode on Weibull analyses, and 65% of failed devices are recommended as a suitable termination for reliability tests.

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