Development of <scp>PPTA</scp>/cellulose three‐layer composite insulating paper with low dielectric constant and good mechanical strength based on molecular dynamics simulation

Yang, Mujie; Yang, Lijun; Yin, Fei; Gao, Yuanyuan; Liao, Ruijin

doi:10.1002/pc.26489

Cited by 15 publications

(6 citation statements)

References 50 publications

(61 reference statements)

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Volume resistivity tests and AC breakdown strength tests were conducted on sample P and sample 0# to 4# respectively, and each sample was tested in 10 sets each. Figure 7 shows the volume resistivity of each group of samples, the Weibull distribution of AC breakdown test (the Weibull parameters are depicted in Table S2), AC breakdown test data is processed using the two‐parameter Weibull distribution, analysis by Equation () 45 :

P goodbreak= 1 goodbreak- italicexp ([], goodbreak- {(\frac{E}{α})}^{β})

where, E is the breakdown strength; P is the failure probability; α is the scale parameter, which represents the breakdown field strength at a failure probability of 63.2%; β is the shape parameter, which represents the dispersion of the data. Among them, the larger β is, the smaller the dispersion of the data.…”

Section: Resultsmentioning

confidence: 99%

“…Volume resistivity tests and AC breakdown strength tests were conducted on sample P and sample 0# to 4# respectively, and each sample was tested in 10 sets each. Figure 7 shows the volume resistivity of each group of samples, the Weibull distribution of AC breakdown test (the Weibull parameters are depicted in Table S2), AC breakdown test data is processed using the two-parameter Weibull distribution, analysis by Equation (4) 45 :…”

Section: Dielectric Propertiesmentioning

confidence: 99%

See 1 more Smart Citation

High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

Liang,

Feng,

Yang

et al. 2023

Polymer Composites

View full text Add to dashboard Cite

Epoxy resin, as an adhesive for the main insulation system of large generators, has excellent insulation properties. But its poor thermal conductivity limits the capacity enhancement of large generators. Forming thermally conductive pathways by using electric field to induce high thermal conductivity fillers in the polymer can effectively improve the thermal conductivity of the composite at low loading condition. In this article, a DC electric field is used in epoxy resin (EP) to induce two‐dimensional inorganic fillers h‐BN deflection and head‐to‐tail lap, which can make the heat flow transfer along the in‐plane of the particles and contribute to the more efficient thermal conductivity network. A high thermal conductivity of 0.544 W/(m K) was achieved at a low load of 10 wt%, which has an improvement of 289% compared to pure EP (0.14 W/[m K]) and 130% compared to the randomly dispersed composite with the same load. The composites have excellent thermal conductivity as well as insulating properties, among which volume resistivity is 1.46 × 1012 Ω/cm, increasing by 61.4% compared to pure EP. This method is easy to be carried out in engineering and has great possibilities for the main insulation of large generators and even for other applications with high thermal conductivity electrical insulation.Highlights The structure of composites was adjusted by direct current electric field. The high in‐plane thermal conductivity of h‐BN is fully exploited. The relationship between deflection angle of BN and thermal conductivity of composites was built.

show abstract

P goodbreak= 1 goodbreak- italicexp ([], goodbreak- {(\frac{E}{α})}^{β})

Section: Resultsmentioning

confidence: 99%

“…Volume resistivity tests and AC breakdown strength tests were conducted on sample P and sample 0# to 4# respectively, and each sample was tested in 10 sets each. Figure 7 shows the volume resistivity of each group of samples, the Weibull distribution of AC breakdown test (the Weibull parameters are depicted in Table S2), AC breakdown test data is processed using the two-parameter Weibull distribution, analysis by Equation (4) 45 :…”

Section: Dielectric Propertiesmentioning

confidence: 99%

High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

Liang,

Feng,

Yang

et al. 2023

Polymer Composites

View full text Add to dashboard Cite

show abstract

“…For the balanced PI/cellulose blending system, the static mechanical performance parameters of the system can be obtained by applying small stress and collecting the strain information of the material during the MD simulation (Du et al 2021a;Zheng et al 2016). Combining constant strain energy minimization, Hucker's law, and the Reuss averaging method, the shear modulus G, volume modulus K, and toughness parameters K/G can be calculated (Mo et al 2022a;Tang et al 2017b).…”

Section: Calculation Of Mechanical Propertiesmentioning

confidence: 99%

Enhancement of thermal stability and insulation properties of cellulose composites insulating paper by the first introduction of polyimide fiber

Wei

Zhang

Chen

et al. 2023

Preprint

View full text Add to dashboard Cite

Traditional inefficient "tentative" trial and error experiments are difficult to rapidly and efficiently prepare synthetic fiber/cellulose composites with high thermal stability and strong insulation properties because the direct scientific theory or simulation guidance is insufficient. In this paper, PI fiber is the first time introduced to cellulose insulating paper. The mechanical, thermal stability, and dielectric properties of PI/cellulose composite insulating paper are predicted by molecular dynamics (MD) simulation. The composite insulating papers with the corresponding content of PI fiber were prepared and their thermal stability, mechanical properties, and electrical properties were investigated. Relative to the pure cellulose insulating paper, the 6% PI/cellulose insulating paper is the most representative, its tensile strength increased by 26.24%, the glass transition temperature increased from 113.4 to 124.7 K, permittivity decreased from 4.22 to 3.25, the dielectric loss decreased by 58.33% at 50 Hz, and the breakdown strength increased by 30.35%. This work confirms the effectiveness of MD simulation to rapidly guide the preparation of the new composite insulating paper, which can provide a reference for the future expansion and development of synthetic fiber in the preparation of cellulose insulating paper, and proves that PI fiber can enhance the thermal stability and insulation properties of cellulose insulating paper.

show abstract

“…The utilization of MD simulation methods is on the rise in the study of designed polymers primarily due to the prohibitive costs associated with conducting experiments. This approach enables the indirect calculation of a polymer’s dielectric properties postcuring, − the prediction of its thermodynamic characteristics, and a comprehensive understanding of its cross-linked structure, along with insights into the impact of chemical bonds on dielectric properties. The exploration of MD simulations for thermosetting resins began early. − However, until Heine et al introduced the dynamic cross-linking method based on the cutoff distance criterion to simulate epoxy resin’s structure and mechanical properties, simulation research on cured polymer resins gained momentum.…”

Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Chen,

Yi,

Lan

et al. 2023

J. Phys. Chem. B

View full text Add to dashboard Cite

Benzocyclobutene (BCB)-based resins have garnered considerable attention because of their remarkable dielectric properties and thermal stability. However, in molecular dynamics (MD) simulations, progress in BCB-based resin research has yet to keep pace with experimental advancements, resulting in a shortage of theoretical underpinnings at the molecular level. This study focuses on a novel homopolymer, poly(2-(4-benzocyclobutenyl)-divinylbenzene(DVB-S-BCB)), and devises an interactive methodology suitable for BCBbased resins. We implemented a Python script for the joint relaxation method to construct a three-dimensional model of the cured polymer using MadeA and LAMMPS. We conducted MD simulations to investigate how the cross-linking degree and resin molecular weight influence the dielectric properties of the cured polymer. Furthermore, we analyzed the thermodynamic properties through simulation. The results illustrate that augmenting the cross-linking degree and resin molecular weight results in a higher cross-linking density and reduced free volume, thereby increasing the dielectric constant of the resin. The cross-link density does not increase indefinitely with molecular weight, and after a certain threshold is reached, it cannot have a significant effect on the dielectric constant. The degree of cross-linking exerts a more pronounced impact on the dielectric constant than the molecular weight of the resin. In addition, the simulation results denote the excellent thermodynamic properties of the cured polymer. This study also examines the dielectric and thermodynamic properties of the resin samples that were experimentally prepared. The obtained data successfully confirm the reliability of the simulation results. This study offers novel insights for future simulation research on benzocyclobutene-based resins. Additionally, it provides theoretical support for exploring experimental work on low-dielectric materials in the electronic field.

show abstract

Development of PPTA/cellulose three‐layer composite insulating paper with low dielectric constant and good mechanical strength based on molecular dynamics simulation

Cited by 15 publications

References 50 publications

High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

Enhancement of thermal stability and insulation properties of cellulose composites insulating paper by the first introduction of polyimide fiber

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Contact Info

Product

Resources

About