Development of rapid mask fabrication technology for micro-abrasive jet machining

Abstract

Micro-machining of a brittle material such as glass or silicon is important in micro fabrication. Particularly, microabrasive jet machining (µ-AJM) has become a useful technique for micro-machining of such materials. The µ-AJM process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of microparticles. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the µ-AJM process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the µ-AJM. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Therefore, rapid and economic mask fabrication can be possible for the micro-abrasive jet machining. Two kinds of mask patterns were fabricated by using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer was conducted successfully.

Experimental investigation on modified air abrasive jet machining (MAAJM)

“…The analysis predicted and measured PMMA surface profiles attains a good agreement in un masked channels up to 1.2 mm depth, and also erosion rate changes with temperature variations during machining. Lee et al (2008) projected their work on high velocity micro particles striking the non-working area. They found that non-working area surfaces are damaged.…”

The Investigation on the Abrasive Jet to Change the Contact Angle of Solid Material Surface

“…Processed through the abrasive, substrate surface have deformation by the impact of high-speed particles, substrate surface topography will produce relatively large changes, and the surface morphology changes are often accompanied by some changes in physical properties, for example surface roughness changes, surface contact angle changes [4][5][6].…”