Development of Process for Fast Plasma-Chemical Through Etching of Single-Crystal Quartz in SF6/O2 Gas Mixture

Осипов, А. А.; Александров, С. Е.; Berezenko, Vladimir I.

doi:10.1134/s1070427218080025

Cited by 13 publications

(6 citation statements)

References 20 publications

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“…Inductively coupled plasma dry etching has proved effective for processing single-crystal quartz. The plasma-chemical etching process can etch a single-crystal quartz plate (z-cut) with a thickness of 369 μm through windows with large linear dimensions (3 mm × 10 mm) [17]. A few institutions have used ICP systems to achieve a depth of quartz of over 100 µ m [18,19].…”

Section: The Design Of the Overall Processmentioning

confidence: 99%

Research on a Micro-Processing Technology for Fabricating Complex Structures in Single-Crystal Quartz

Han

Zhao

et al. 2020

Micromachines

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Single-crystal quartz material is widely applied in the manufacture of resonators and sensors, but it is difficult to process because of its high hardness. A novel way to fabricate single-crystal quartz structures is proposed in this paper; the method includes quartz-on-silicon (QoS) technology and inductively coupled plasma (ICP) etching, which makes it feasible to fabricate complex structures with crystal quartz. The QoS method encompasses the bonding of silicon and quartz, followed by the thinning and polishing of quartz, which can enable the fabrication of an ultra-thin quartz wafer on silicon. In this way, instead of the conventional wet etching with hydrofluoric acid, the quartz layer can be easily etched using the ICP dry-etching method. Then, the structure of the pure quartz material is obtained by removing the silicon wafer. In addition, the silicon layer can be processed into the appropriate structure. This aspect overcomes the difficulty of processing a complex structure of single-crystal quartz with different crystal orientations. Thin single-crystal quartz wafers of Z-cut with a thickness of less than 40 μm were obtained by using this method, and a complex three-dimensional structure with an 80 μm width was also acquired by the ICP etching of the quartz wafer. The method can be applied to make both crystal-oriented quartz-based sensors and actuators, such as quartz resonant accelerometers.

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Section: The Design Of the Overall Processmentioning

confidence: 99%

Research on a Micro-Processing Technology for Fabricating Complex Structures in Single-Crystal Quartz

Han

Zhao

et al. 2020

Micromachines

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“…Systems consisting of two, three or more piezo actuators connected with each other can be of the utmost interest. The said approach to the problem allows performing movement at the required distance in one or several needed directions (Bardin and Vasil'ev, 2017;Osipov et al, 2018).…”

Section: Linear Drive Based On the System Of Piezo Actuatorsmentioning

confidence: 99%

Control of the System of Piezoelectric Actuator Devices for Precision Drive Systems

Матвеев¹,

Yakovenko²,

Konoplev³

et al. 2020

Int J Math, Eng, Manag Sci

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“…The scheme of the reactor unit of the system, as well as a more detailed description of the plant, can be found in the works [12,13,14].…”

Section: Fig 3 General View Of the System Of Deep Etching Of Silicon ...mentioning

confidence: 99%

Registration of an ICP Plasma CV Dependences under Various Pressures in the Plasma-Chemical Deep Etching System

Iankevich

2019

KEM

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Development of Process for Fast Plasma-Chemical Through Etching of Single-Crystal Quartz in SF6/O2 Gas Mixture

Cited by 13 publications

References 20 publications

Research on a Micro-Processing Technology for Fabricating Complex Structures in Single-Crystal Quartz

Research on a Micro-Processing Technology for Fabricating Complex Structures in Single-Crystal Quartz

Control of the System of Piezoelectric Actuator Devices for Precision Drive Systems

Registration of an ICP Plasma CV Dependences under Various Pressures in the Plasma-Chemical Deep Etching System

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