Development of probing mark analysis model [IC testing]

Chao, Yang; Lee, Y.J.; Liu, J.; Shen, Guohui; Tsai, Feng-Chin; Liu, D.S.; Shih, Meng-Kai

doi:10.1109/eptc.2003.1298690

Cited by 4 publications

(7 citation statements)

References 2 publications

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“…The results obtained from the simplified model for the scrub mark length are particularly inaccurate. In practice, this can be attributed to the use of the rigid-body rotation assumption in (5). Table V shows the optimized values of the needle design parameters for each of the four rows of the KX869TW probe card.…”

Section: Validation Of Optimization Resultsmentioning

confidence: 98%

“…In most practical applications, the contact force should not exceed 2.5 gf/mil and the scrub mark should terminate at a point no closer than 5-8 μm from the pad boundary [1]. The literature contains many numerical and experimental investigations into the relationship between the contact force and the scrub mark length in the probe testing of aluminum pads using a single tungsten needle [2]- [5]. In general, the results show that the contact force and the scrub mark length both increase with an increasing overdrive level.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Liu

Chang

et al. 2011

IEEE Trans. Compon., Packag. Manufact. Technol.

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Wafer testing in the semiconductor industry is generally performed using a multilayer probe card. In this paper, Castigliano's second theorem is used to derive analytical formulae for the contact force and scrub mark length generated during the probing test. The formulations are then integrated with a multiobjective programming algorithm to optimize the probe needle parameters in such a way as to ensure a uniform contact force and a minimum scrub mark length. The validity of the analytical model is confirmed by comparing the solutions obtained for the contact force and scrub mark length with the equivalent results obtained from finite element simulations. The effectiveness of the analytical model and optimization procedure is demonstrated by optimizing the needle parameters of a commercial four-layer probe card. It is shown that the optimized probe card not only produces a more uniform contact force than the original probe card but also yields a shorter and more uniform scrub mark length.Index Terms-Castigliano's theorem, energy method, epoxy ring probe card, finite element method, wafer-level probing test.

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Section: Validation Of Optimization Resultsmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Liu

Chang

et al. 2011

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Several literatures (Bates, 1997;Comeau and Naduau, 1991;Chao et al, 2003;Liu and Shih, 2006) revealed that the contact force sensitivity is a function of the dimensions of probing needle, but none of them studied the effect of the geometric changes on the contact force and the forward displacement systematically. In this study, a finite element model of a cantilever needle was first constructed to simulate the stress distribution and the needle tip displacement during probing.…”

Section: Fig 1 -Epoxy Ring Probe Card For DVI Probing Test (Providedmentioning

confidence: 99%

“…Broz and Rincon (1999) proposed a contact theory of the probe tip and the weld pad, and discussed the effect of the temperature arising on contact resistance. Chao et al (2003) built a 3-D finite element model to simulate probe testing, and single probe experiments were performed in micro-tester. The relation between contact forces and overdrive of the probing mark were obtained.…”

Section: Introductionmentioning

confidence: 99%

Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Chang

2009

Journal of Materials Processing Technology

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“…In the literature, usually the authors analyze the bond pad failure with static modeling, results might be correlated with experimental results [5,6]. Some studies point out the dynamic deformation of contact phenomenon with explicit finite elements analysis and investigate the scrub mark on the die [7,8]. The reaction force and dynamic behavior of needle is simulated by Schmadlak and al., they observe dynamic effects during the first 100µs after the impact time but its magnitude remains low [9].…”

Section: Probing Simulationmentioning

confidence: 99%

Study of Probing Test for Electrical Wafer Sort Application: Dynamical Simulation and Experimental Measurement

Cacho

Vettori²,

Thiery³

et al. 2007

2007 9th Electronics Packaging Technology Conference

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Electrical Wafer Sort process is known to induce stress in the pad structure and can lead to yield loss. In the present paper, probing simulation with Finite Element Method is performed and faced to experimental measurements. Firstly, the contact surface for planar and non-planar impacts and the needle structural lateral reaction force studies are carried out with static simulation. Then, using explicit solver, a calibration of the vertical and lateral reaction forces is performed for different over travel distances and needle geometries. Dynamical results of simulation are in good agreement with experimental measurements. The analysis shows that inertial effects during probing process remain limited. In addition to that, the measured force features are well reproduced by modeling, particularly the fine effects observed during the unloading stage. Finally, the effect of aluminium mechanical behavior is discussed by introducing permanent deformation ability of the pad.

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Development of probing mark analysis model [IC testing]

Cited by 4 publications

References 2 publications

Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Optimization of Multilayer Probe Card Using Strain Energy-Based Analytical Model and Multiobjective Programming Algorithm

Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Study of Probing Test for Electrical Wafer Sort Application: Dynamical Simulation and Experimental Measurement

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