Development of predictive modeling scheme for flip-chip on fine pitch flex substrate

We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing schemes. The new scheme is based on the experimentally-observed unique hygroscopic behavior of polymeric materials used in microelectronics; i.e., the saturated concentration is only a function of relative humidity regardless of temperature. A new analogy formulation based on the modified solubility is presented and the scheme is implemented to investigate its accuracy and applicability. The results from a simple case study corroborate that the advanced scheme can be used effectively for package assemblies subjected to general anisothermal loading conditions.

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Development of predictive modeling scheme for flip-chip on fine pitch flex substrate

Cited by 3 publications

References 11 publications

A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process

A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process

Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

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