2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00158
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Development of Novel Photosensitive Dielectric Material for Reliable 2.1D Package

Yune Kumazawa
1
,
Seiji Shika
2
,
Shunsuke Katagiri
3
et al.
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Cited by 9 publications
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