Development of novel flexible heat pipe with multistage design inspired by structure of human spine

Huang, Jiale; Zhou, Wei; Xiang, Jianhua; Liu, Chengzhong; Gao, Yu; Li, Shuangli; Ling, Weisong

doi:10.1016/j.applthermaleng.2020.115392

Cited by 35 publications

(17 citation statements)

References 24 publications

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“…In this research, we studied the effectiveness of an FFF 3D printed LCP polymer thermosiphon. Prior research in polymer thermosiphons focused on using a combination of polymer (polyvinylchloride, [ 12 ] fluororubber, [ 15 ] polyurethane, [ 16 ] and PET [ 14 ] ) with metal (copper). These non‐3D printed prototypes were thin (diameters ranging between 1.8 and 6 mm) and long (length ranging between 75 and 450 mm) thermosiphons.…”

Section: Resultsmentioning

confidence: 99%

3D Printed Liquid Crystal Polymer Thermosiphon for Heat Transfer under Vacuum

Seshadri

Hischier

Masania

et al. 2023

Adv Materials Technologies

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A novel approach is presented to 3D print vacuum–tight polymer components using liquid crystal polymers (LCPs). Vacuum–tight components are essential for gas storage and passive heat transfer, but traditional polymer 3D printing methods often suffer from poor interfaces between layers and high free volume, compromising vacuum integrity. By harnessing the unique properties of LCPs, including low free volume and low melt viscosity, highly ordered domains are achieved through nematic alignment of polymer chains. Critical gas–barrier properties are demonstrated, even in thin, single–print line–walled samples ranging from 0.8 to 1.6 mm. A 200 mm evacuated thermosiphon is successfully printed, which exhibits a thermal resistance of up to 2.18 K/W and an effective thermal conductivity of up to 28 W/mK at 60 °C. These values represent a significant increase compared to the base LCP material. Furthermore, the geometric freedom, enabled by 3D printing through the fabrication of complex–shaped thermosiphons, is showcased. The authors study highlights the potential of LCPs as high–performance materials for 3D printing vacuum–tight components with intricate geometries, opening new avenues for functional design. An application of integrating 3D printed thermosiphons as selective heat transfer components in building envelopes is presented, contributing to greenhouse gas emissions mitigation in the construction sector.

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Section: Resultsmentioning

confidence: 99%

3D Printed Liquid Crystal Polymer Thermosiphon for Heat Transfer under Vacuum

Seshadri

Hischier

Masania

et al. 2023

Adv Materials Technologies

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“…Such innovative design of the cooling system is very beneficial for foldable electronic equipment such as tablets and smartphones. Huang et al 134 also used the copper screen mesh as a wick structure for flexible heat pipe manufacturing. The design of the set-up was inspired by the human spine, which is strong as well as flexible at the same time.…”

Section: Latest Advancements In the Development Of The Vapour Chambermentioning

confidence: 99%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

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“…In facing issues of the heat dissipation of flexible electronic components, the application of rigid heat pipes was greatly limited. In contrast, flexible heat pipes may transfer heat at different bending angles and maintain high heat transfer efficiency under repeated bending experiments, which has now become a new trend in the field of electronic heat dissipation [ 24 , 25 , 26 ].…”

Section: Introductionmentioning

confidence: 99%

“…The flexible heat pipe usually consists of three sections: an evaporating section, a condensing section, and an adiabatic section. According to previous research, current flexible heat pipes may be divided into two categories: single articulated flexible heat pipes and non-articulated flexible heat pipes [ 24 ]. The single articulated flexible heat pipe uses a flexible connector as the adiabatic section to connect the evaporating section to the condensing section.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Thermal Performance of a Polymer-Based Flexible Oscillating Heat Pipe via 3D Printing Technology

Han

Chang

2023

Polymers

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As flexible electronic technologies rapidly developed with a requirement for multifunction, miniaturization, and high power density, effective thermal management has become an increasingly important issue. The oscillating heat pipe, as a promising technology, was used to dissipate high heat fluxes and had a wide range of applications. In this paper, we reported the fabrication and heat transfer performance evaluation of a polymer-based flexible oscillating heat pipe (FOHP) prepared using 3D printing technology. The 3D-printed inner surface presented excellent wettability to the working fluid, which was beneficial for the evaporation of the working fluid. Ethanol was selected as the working fluid, and the influence of the filling ratios range of 30–60% on heat transfer performance was analyzed. It was found that a 3D-printed FOHP with a filling ratio of 40% presented the best heat transfer performance with the lowest thermal resistance, and the fabricated heat pipes could be easily bent from 0° to 90°. With the best filling ratio, the thermal resistance of the FOHPs increased with larger bending angles. In addition, the 3D-printed FOHP was successfully applied for the thermal management of flexible printed circuits, and the results showed that the temperature of flexible printed circuits was kept within 72 °C, and its service life was guaranteed.

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Development of novel flexible heat pipe with multistage design inspired by structure of human spine

Cited by 35 publications

References 24 publications

3D Printed Liquid Crystal Polymer Thermosiphon for Heat Transfer under Vacuum

3D Printed Liquid Crystal Polymer Thermosiphon for Heat Transfer under Vacuum

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Fabrication and Thermal Performance of a Polymer-Based Flexible Oscillating Heat Pipe via 3D Printing Technology

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