Development of Next Generation Stretchable Materials for Flexible Hybrid Electronics (FHE)

Ramkumar, S. Manian; Stemmermann, Andrew; Rajan, Benny Mathew; Quelhas, Isabelle; Alhendi, Mohammed; Poliks, Mark D.; Abbara, El Mehdi; Chan, Benson; Ogiwara, Toshiaki; Saki, Nori; Otomo, Masayoshi; Araujo, Ken

doi:10.1109/ectc32862.2020.00135

Cited by 7 publications

(2 citation statements)

References 11 publications

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“…For level 2 interconnects, contacts are mostly realized by means of soft solder and conductive adhesives. For these nondetachable types of interconnects, even on printed electronics, a small number of publications can be found [11][12][13][14][15][16][17][18]. More often, epoxy based isotropic conductive adhesives are used to create those level 2 interconnects [11][12][13][14][15][16][17][18].…”

Section: Background and Motivationmentioning

confidence: 99%

“…For these nondetachable types of interconnects, even on printed electronics, a small number of publications can be found [11][12][13][14][15][16][17][18]. More often, epoxy based isotropic conductive adhesives are used to create those level 2 interconnects [11][12][13][14][15][16][17][18]. In [12] it has been shown that the electrial resistances as well as the long-term behaviour of such interconnects on printed conductor patterns are comparable to those on conventionally etched printed circuit boards [12,13].…”

Section: Background and Motivationmentioning

confidence: 99%

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Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Schirmer¹,

Hümmer²,

Klauß³

et al. 2021

Flex. Print. Electron.

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Hybrid printed electronics (HPE) combines advantages of conventional electronics manufacturing technologies such as surface mount technology with those of printed electronics in order to realize more complex electronic systems. To realize the final product, such HPE subassemblies have to be connected to higher-level assemblies. So far interconnection techniques for the so-called level 3 interconnection between printed subsystems and standard electronics have not yet been considered adequately in scientific research. In this paper, alternative detachable level 3 interconnection technologies, i.e. spring loaded contact pins, zero insertion force (ZIF) as well as Non-ZIF connectors are investigated systematically regarding their electrical behaviour against the background of printed electronics. Screen-printed silver filled polymer thick film paste is used to realize printed conductor patterns on flexible polymer substrates, which are connected later on with the alternatives mentioned above. Transition resistance is measured using the four wire method as produced, after repeated mating cycles as well as after accelerated aging tests. The various electrical contacts are subjected to thermal stress in temperature cycling testing and during aging at a constant high temperature. As a result it can be stated, that the sping-loaded contact pins used in this investigation show superior behavior compared with the selected connectors in terms of resistance increase after mating cycles. Concerning long-term behavior after thermal cyling and high temperature storage, all investigated alternaives reveal convincing results.

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