Development of new capacitive strain sensors based on thick film polymer and cermet technologies

Strain-dielectric response of dielectrics as foundation for electrostriction stresses

“…The solid-state capacitor sensor incorporating a dielectrostriction sensing mechanism provides a more robust structure than the conventional vacuum-gap capacitance sensor and is easy to be manufactured with the selection of various dielectric materials potentially optimized by dynamic properties and environmental requirements. Tan and Castner 17 and Arshak et al 18 employed parallel-plate capacitors to detect the change in dielectric properties of the uniaxially loaded material. However, such parallel-plate configuration has inherent difficulties with the boundary conditions, as described in Sec.…”

Energy Harvesting Technologies: Thick-Film Piezoelectric Microgenerator

“…The earlier form of PVDF was in polymer sheet, which is difficult to be shaped in micro-scale and they are usually processed with a punching technique based on a micro-embossing technique which is described in the literature [18]. With the development of PVDF thin-film technology, microstructures can be fabricated as reported by Arshak et al [19]. The fabrication process involved drying and curing at low temperature of around 170 °C, and was able to produce d 33 of 24 pC/N 1 [20].…”

Investigation into the pressure sensing properties of PVDF and PVB thick film capacitors

“…If this is the case, α-phase PVDF may be more useful. For example, it has successfully been employed in the fabrication of thick film strain gauges working on a capacitive principle [15]. Furthermore, interdigitated electrodes, covered with a PVDF dielectric layer have been incorporated into a wireless measurement system and showed good sensitivity to hydrostatic pressure [16].…”