Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps

Oi, Kiyoshi; Otake, Satoshi; Shimizu, Nobutaka; Shoji, Watanabe; Kunimoto, Yuji; Kurihara, Takashi; Koyama, Toshinori; Tanaka, Masato; Aryasomayajula, Lavanya; Kutlu, Zafer

doi:10.1109/ectc.2014.6897310

Cited by 97 publications

(10 citation statements)

References 4 publications

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“…20 and Fig. 21 illustrate two different types of organic interposer packages ("iTHOP" from Shinko [52] and "APX" from Kyocera [53]). In both cases, chip-to-chip interconnect bandwidth can be increased significantly as the technologies support less than 5 μm line/space design rules and bump pitch as fine as 55 μm.…”

Section: Multi-function Chiplets Integrationmentioning

confidence: 99%

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Liu

Sadhu

2021

IEEE J. Microw.

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Section: Multi-function Chiplets Integrationmentioning

confidence: 99%

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Liu

Sadhu

2021

IEEE J. Microw.

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“…3.1.5 Thick Substrate. For the advanced heterogenous package, multiple devices are placed on one substrate and thus the number of signal I/Os and power I/Os tend to increase the effective substrate thickness [80,81,117]. When substrates become thicker, the vertical thermal resistance is increased by the number of substrate dielectric layers that nominally have low-thermal conductivity.…”

Section: Thermal Interface Materialsmentioning

confidence: 99%

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

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Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

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“…In addition, the relatively thick laminates prevent the down scaling of microvias. These constraints eventually led to the proliferation of organic build-up substrate process technologies enabling complex signal routing and high-density interconnects essentially for HPC and millimeter wave (mm-wave) applications [16], [17].…”

Section: Introductionmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps

Cited by 97 publications

References 4 publications

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

RF Glass Technology Is Going Mainstream: Review and Future Applications

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