Development of low temperature co-fired ceramic (LTCC) coatings for electrical conductor wires

Abstract

Dip coating was employed to apply low temperature co-firing ceramic (LTCC) zinc molybdate coatings to the surfaces of Ni-coated Cu conductor wires. Zinc molybdate ceramic powders were synthesized via a solid state route; ceramic suspensions for dip coating were prepared by mixing the LTCC powders in an organic solution. By optimizing the dip coating parameters and subsequent heat treatment, ceramic films, with a typical insulation thickness of 47.3 μm and dielectric strength of 24.2 kV•mm -1 , were formed on the surfaces of Ni test discs. The processing parameters were transferrable to the coating of Ni-coated Cu wires; the resulting wires exhibited an insulation thickness of 40.3 μm and breakdown voltage of 798 V.

Research Progress in High-Temperature-Resistant Electromagnetic Wire

“…The conductor was impregnated in the ceramic slurry by the pull-film method, and the thickness could be controlled between 10 and 30 µm after sintering. Zijing Wang [79,80] reported a new LTCC material based on the 11ZnO-10MoO 3 formula, which can be sintered at 850 • C and has good dielectric and thermal properties, making it an ideal choice for dip-coating and co-firing applications. They further coated this material on a nickel-plated copper conductor wire by the impregnation method, and formed a ceramic film with a thickness of 47.3 µm and a dielectric strength of 24.2 kV•mm −1 on the Ni test piece.…”

A review on insulation challenges towards electrification of aircraft

“…In order to enhance the performance of cable insulation in high temperature resistance, anti-corona and high-voltage resistance, material selection and structure design should be concerned. Take ceramic materials (such as Al 2 O 3 , AlN) as an example, their thermal conductivity, heat dissipation capacity are high, so the kind of materials has been widely used in IGBT [93]. Compared with traditional polymer insulation materials, the dielectric constant of ceramic materials is higher, and the application is limited.…”