2009
DOI: 10.1109/tasc.2009.2018268
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Development of Integrated Terahertz Broadband Detectors Utilizing Superconducting Hot-Electron Bolometers

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Cited by 28 publications
(2 citation statements)
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“…Over the past few decades, due to the advancement in the nanoscale fabrication, there has been a significant surge of progress in enabling integrated, compact and efficient chip-scale solid-state semiconductor technology that can operate at room temperature and can be manufactured at a low cost, exploiting economies of scale. Considerable work has been directed towards miniaturized technologies demonstrated with quantum-cascade lasers [5], microbolometers [6], nanowires [7], novel plasmonic nanostructures [8], metamaterials [9] and ultrafast conductive semiconductor materials [10]. This progress has resulted a major step towards a more holistic approach for realizing the development of THz systems for applications in communication, spectroscopy and hyperspectral imaging [11].…”
Section: Introductionmentioning
confidence: 99%
“…Over the past few decades, due to the advancement in the nanoscale fabrication, there has been a significant surge of progress in enabling integrated, compact and efficient chip-scale solid-state semiconductor technology that can operate at room temperature and can be manufactured at a low cost, exploiting economies of scale. Considerable work has been directed towards miniaturized technologies demonstrated with quantum-cascade lasers [5], microbolometers [6], nanowires [7], novel plasmonic nanostructures [8], metamaterials [9] and ultrafast conductive semiconductor materials [10]. This progress has resulted a major step towards a more holistic approach for realizing the development of THz systems for applications in communication, spectroscopy and hyperspectral imaging [11].…”
Section: Introductionmentioning
confidence: 99%
“…To enable this diverse set of applications, there has been a concerted effort in the research community to miniaturize complex THz systems into chip-scale form that are operable at room temperature. Wedged between the microwave band and the infrared spectrum, this effort has spanned across a large array of substrates ranging from solid-state to photonic devices 1014 , 2D nano-materials 15,16 , quantum-cascade lasers (QCLs) 1719 , microbolometers 20,21 , nanowires 22 , metamaterials 23 , and ultrafast photoconductive materials 24,25 . In recent years, even silicon, particularly complementary-metal-oxide-semiconductor (CMOS) based integrated circuits and chips have been demonstrated in the frequency range with power generation capability in the range of 100s of μW 26–29 and detection capability with sensitivities (noise-equivalent-power) in the sub-100 pW/ region 3037 .…”
Section: Introductionmentioning
confidence: 99%