Development of innovative substrate and embedding technologies for high frequency applications

Manessis, D.; Kosmider, Stefan; Boettcher, Lars; Seckel, Manuel; Murugesan, Kavin Senthil; Maas, Uwe; Ndip, Ivan; Ostmann, A.; Aschenbrenner, R.; Schuster, Martin; Lang, K.-D.

doi:10.23919/empc53418.2021.9584975

Cited by 5 publications

(4 citation statements)

References 11 publications

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“…It was reported that the roughness contributed a percentage as high as 25% to total signal loss on common copper foil by ATOTECH (Liang et al , 2006). Generally, the roughness must be smaller than the skin depth at the corresponding application frequency to avoid obvious impedance mismatching and signal loss, and a roughness less than 0.4 µm has been recommended even only at 10 GHz, which suggests that a more smooth surface will be needed at mm-wave frequency bands (Manessis et al , 2021).…”

Section: Key Technical Demands On Pcb In 5g Mm-wave Applicationmentioning

confidence: 99%

Investigation on the new reliability issues of PCB in 5G millimeter wave application

He,

Huang,

Xiao

et al. 2023

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Purpose The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology. Design/methodology/approach The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test. Findings To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated. Originality/value The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

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Section: Key Technical Demands On Pcb In 5g Mm-wave Applicationmentioning

confidence: 99%

Investigation on the new reliability issues of PCB in 5G millimeter wave application

He,

Huang,

Xiao

et al. 2023

View full text Add to dashboard Cite

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“…In this way, the loads are "hidden" beneath the back plane and do not interfere with the incident electromagnetic waves or obstruct the aperture; the connection between the patches and loads is accomplished by means of through vias (TVs). The fabricated [19,20] metasurface boards consist of 18 × 26 cells, for an effective aperture of 162 mm × 234 mm. Photographs of both sides of the metasurface boards can be found in Figs.…”

Section: Multifunctional Metasurface Architecturementioning

confidence: 99%

Multifunctional Metasurface Architecture for Amplitude, Polarization and Wave-Front Control

et al. 2022

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“…This way, the loads are "hidden" beneath the backplane and do not interfere with the incident electromagnetic waves nor obstruct the aperture; connection between patches and loads is accomplished by means of through vias (TVs). The fabricated [18,19] metasurface boards consisted of 18 × 26 cells, for an effective aperture of 162 mm × 234 mm. Photographs of both sides of the metasurface boards can be found in the Supplemental Material [20] [Fig.…”

Section: Multi-functional Metasurface Architecturementioning

confidence: 99%

Multi-functional metasurface architecture for amplitude, polarization and wavefront control

Pitilakis,

Seckel,

Tasolamprou

et al. 2022

Preprint

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Metasurfaces (MSs) have been utilized to manipulate different properties of electromagnetic waves. By combining local control over the wave amplitude, phase, and polarization into a single tunable structure, a multifunctional and reconfigurable metasurface can be realized, capable of full control over incident radiation. Here, we experimentally validate a multi-functional metasurface architecture for the microwave regime, where in principle variable loads are connected behind the backplane to reconfigurably shape the complex surface impedance. As a proof-of-concept step, we fabricate several metasurface instances with static loads in different configurations (surface mount capacitors and resistors of different values in different connection topologies) to validate the approach and showcase the different achievable functionalities. Specifically, we show perfect absorption for oblique incidence (both polarizations), broadband linear polarization conversion, and beam splitting, demonstrating control over the amplitude, polarization state, and wavefront, respectively. Measurements are performed in the 4-18 GHz range inside an anechoic chamber and show good agreement with theoretically-anticipated results. Our results clearly demonstrate the practical potential of the proposed architecture for reconfigurable electromagnetic wave manipulation.

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Development of innovative substrate and embedding technologies for high frequency applications

Cited by 5 publications

References 11 publications

Investigation on the new reliability issues of PCB in 5G millimeter wave application

Investigation on the new reliability issues of PCB in 5G millimeter wave application

Multifunctional Metasurface Architecture for Amplitude, Polarization and Wave-Front Control

Multi-functional metasurface architecture for amplitude, polarization and wavefront control

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