“…The subsurface damage of monocrystalline silicon was mainly due to the formation of amorphous layers on the surface, and the thickness of the amorphous layer can be dissected by the peak intensity of silicon in the Raman spectrum. 27,28 Fig. 5 depicts the Raman spectra of silicon wafers before and after CMP, where c-Si represents monocrystalline silicon and a-Si represents amorphous silicon.…”