2011
DOI: 10.1016/j.matdes.2010.08.028
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Development of high strength, high conductivity copper by friction stir processing

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Cited by 96 publications
(54 citation statements)
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“…Table 2 shows the defect-free macrostructure and peak temperature variations for FSPed Cu and fabrication of surface-level microcomposites and nanocomposites by FSP. The peak temperature rise varies between 328 °C and 358 °C , indicating that low-heat-input conditions occurred during FSP, where the grain refinement phenomenon was dominant, and that no phase transformation occurred during FSP [18]. It can be observed that the peak temperature for microcomposites is slightly higher than that for nanocomposites; this is because of the presence of microsized SiCps, which resist the material flow more than nanosized SiCps during FSP.…”
Section: Macrostructure and Temperature History During Fspmentioning
confidence: 97%
“…Table 2 shows the defect-free macrostructure and peak temperature variations for FSPed Cu and fabrication of surface-level microcomposites and nanocomposites by FSP. The peak temperature rise varies between 328 °C and 358 °C , indicating that low-heat-input conditions occurred during FSP, where the grain refinement phenomenon was dominant, and that no phase transformation occurred during FSP [18]. It can be observed that the peak temperature for microcomposites is slightly higher than that for nanocomposites; this is because of the presence of microsized SiCps, which resist the material flow more than nanosized SiCps during FSP.…”
Section: Macrostructure and Temperature History During Fspmentioning
confidence: 97%
“…The grain growth in stir zone subsequently reduces the microhardness value. The square pin profile generated more heat (370°C) due to its higher pulsating stirring action [9] and it has lower microhardness (88Hv) than other pin profiles. The hexagonal pin tool provided low heat generation of 245°C compared to other types of tool and it has higher microhardness value compared to others.…”
Section: Fig 6 Effect Of Pin Profiles On Processed Zone Hardnessmentioning
confidence: 99%
“…The results revealed that square pin profile produced finer crystallized grain structure, higher degree of plastic deformation at the stir zone. Surekha and Els-Botes [9] have also developed a high strength and high conductivity copper by FSP at low-heat input condition and concluded that peak temperature is the dominant factor determining grain size in their study. Pin profiles can influence the material flow path and degree of plastic deformation [3,8].Thus, the availability of literatures focusing on the effect of FSP tool pin profiles on the formation of stir zone in pure copper at low-heat input conditions are very scarce.…”
Section: Introductionmentioning
confidence: 99%
“…in electrotechnics [4], automotive [5], aircraft [6], military [7], as well as in biomedicine [8,9]. SPD is for example suitable for production of high-strength electro-conductive copper [10], consolidation of nano-scaled Al-based composites [11,12], improvement of corrosion resistance of pure Mg [13], enhancement of hydrogen sorption capacity of Mg [14], decreasing the elastic modulus of Tibased biocompatible alloys [15], and increasing the corrosion resistance of bio-applicable Mg-based alloys [16,17].…”
Section: Introductionmentioning
confidence: 99%