Development of high strength and high electrical conductivity Cu/Gr composites through friction stir processing

Naik, R. Bheekya; Reddy, K. Venkateswara; Reddy, G. Madhusudhan; Kumar, R. Arockia

doi:10.1016/j.matlet.2020.127437

Cited by 26 publications

(5 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[20][21][22][23] The lack of reaction products suggests that the temperature increase during FSP is insufficient to initiate any interfacial reaction. 15…”

Section: Resultsmentioning

confidence: 99%

“…Many investigators have successfully explored the FSP technique to fabricate magnesium, 11 aluminium, 12,13 copper. 14,15 The traversal speed, according to Barmouz et al, 16 has a significant influence on the uniform dispersion of SiC particles in the Cu matrix. From the literature, there is not much work reported based on the comparison of pure Cu FSP and Cu–W surface composites by FSP.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Development of high strength and high electrical conductive Cu and Cu–W composite by friction stir processing: Effect of traverse speed

Naik

Reddy²,

Reddy

et al. 2022

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

In this work, pure copper and copper-tungsten (Cu-W) surface composite is produced using a single pass friction stir processing (FSP) with an intention to enhance the hardness and wear resistance without impairing electrical conductivity. FSP is performed by changing the traverse speed from 50 to 200 mm/min and at a constant tool rotational speed of 600 rpm. The samples extracted from the stir zone are characterized for their microstructure, hardness, wear behaviour and electrical conductivity. The average grain size, at the stir zones, was significantly reduced (from 40 to 3 µm) after FSP. In the case of pure copper, the grain size decreased from 9 to 3 µm with an increase in traverse speed, however, grain size increased from 4 to 6 µm in the case of Cu-W composite. The hardness of FSP’ed Cu and FSP’ed Cu-W surface composite was increased in the order of 52% and 130% compared to the unprocessed copper. The wear rate significantly reduced after FSP also with an addition of W particles. A negligible reduction (1.83% IACS) in electrical conductivity was noticed for both Cu and Cu-W after FSP. This study demonstrates that the FSP is an effective approach to improve the surface mechanical properties of Cu without much impairing the electrical conductivity.

show abstract

“…[20][21][22][23] The lack of reaction products suggests that the temperature increase during FSP is insufficient to initiate any interfacial reaction. 15…”

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Development of high strength and high electrical conductive Cu and Cu–W composite by friction stir processing: Effect of traverse speed

Naik

Reddy²,

Reddy

et al. 2022

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

show abstract

“…However, despite the success of Gr as a reinforcing phase in polymers [ 6 , 7 ] and ceramics [ 8 , 9 ], its application to metals is hampered by severe agglomeration and poor interfacial bonding with metal matrices [ 10 ]. This limits the application of Gr, especially for Gr-reinforced CuMCs, where the use of Gr often results in an enhanced strength at the cost of a reduced plasticity or EC [ 11 , 12 , 13 , 14 , 15 ]. For example, Shi et al [ 16 ] constructed a Gr network (GN) in a Cu matrix via powder metallurgy.…”

Section: Introductionmentioning

confidence: 99%

Simultaneously Enhancing the Strength, Plasticity, and Conductivity of Copper Matrix Composites with Graphene-Coated Submicron Spherical Copper

Yang

Liang

et al. 2022

Nanomaterials

View full text Add to dashboard Cite

In this study, Cu matrix composites reinforced with reduced graphene oxide-coated submicron spherical Cu (SSCu@rGO) exhibiting both high-strength plastic product (UT) and high electrical conductivity (EC) were prepared. SSCu@rGO results in the formation of Cu4O3 and Cu2O nanotransition layers to optimize the interface combination. In addition, as a flow carrier, SSCu@rGO can also render graphene uniformly dispersed. The results show that SSCu@rGO has a significant strengthening effect on the Cu matrix composites. The relative density (RD) of the SSCu@rGO/Cu composites exceeds 95%, and the hardness, UT, and yield strength (YS) reach 106.8 HV, 14,455 MPa% (tensile strength (TS) 245 MPa, elongation (EL) 59%), and 119 MPa; which are 21%, 72%, and 98% higher than those of Cu, respectively. Furthermore, EC is 95% IACS (International Annealed Copper Standard), which is also higher than that of Cu. The strength mechanisms include transfer load strengthening, dislocation strengthening, and grain refinement strengthening. The plastic mechanisms include the coordinated deformation of the interface of the Cu4O3 and Cu2O nanotransition layers and the increase in the fracture energy caused by graphene during the deformation process. The optimized EC is due to SSCu@rGO constructing bridges between the large-size Cu grains, and graphene on the surface provides a fast path for electron motion. This path compensates for the negative influence of grain refinement and the sintering defects on EC. The reduced graphene oxide-reinforced Cu-matrix composites were studied, and it was found that the comprehensive performance of the SSCu@rGO/Cu composites is superior to that of the rGO/Cu composites in all aspects.

show abstract

“…Graphene (G), as a representative of sp 2 -hybridized carbon allotropes, has attracted remarkable attention and research interest due to its excellent mechanical, optical and electronical properties and high charge carrier mobility, [7][8][9][10] which makes it widely applied in various elds. [11][12][13][14][15][16][17][18][19] Theoretically, carbon allotropes can be constructed by changing the periodic motifs within networks of sp 3 -, sp 2 -and sp-hybridized carbon atoms owing to the versatile exibility of carbon atom. When the sp 2 carbon bonds in graphene are partially or completely replaced with acetylenic linkages, novel carbon allotropes will be constructed, named graphynes (GYs).…”

Section: Introductionmentioning

confidence: 99%

First-principles investigation on the bonding mechanisms of two-dimensional carbon materials on the transition metals surfaces

Sun

Wang

2020

RSC Adv.

View full text Add to dashboard Cite

show abstract

Development of high strength and high electrical conductivity Cu/Gr composites through friction stir processing

Cited by 26 publications

References 10 publications

Development of high strength and high electrical conductive Cu and Cu–W composite by friction stir processing: Effect of traverse speed

Development of high strength and high electrical conductive Cu and Cu–W composite by friction stir processing: Effect of traverse speed

Simultaneously Enhancing the Strength, Plasticity, and Conductivity of Copper Matrix Composites with Graphene-Coated Submicron Spherical Copper

First-principles investigation on the bonding mechanisms of two-dimensional carbon materials on the transition metals surfaces

Contact Info

Product

Resources

About