Development of high reliability lead-free solder joint dispersed IMC pillar

Hayashi, Yuriko; Shohji, Ikuo; Nakata, Yoshihiro; Hashimoto, Tomihito

doi:10.1109/eptc.2015.7412284

Cited by 2 publications

(4 citation statements)

References 6 publications

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“…In the joint with Sn-5.0Sb, the die shear force increased with increasing bonding time regardless of the plate type. In the joint, formed IMCs grow and the number of IMCs increases with the increase of the bonding time [7]. As the result, the die shear force was improved by formation and growth of IMCs in the joint.…”

Section: Thermec 2016mentioning

confidence: 92%

“…5(a), fracture occurred in the solder area including IMCs. The previous study has clarified that IMCs are coarsened with increasing bonding time changing their shapes from pillar-shaped to scallop-shaped [7]. When IMCs were coarsened, the dispersion strengthening of solder by IMCs reduced and thus die shear force decreased.…”

Section: Thermec 2016mentioning

confidence: 98%

“…(Cu,Ni) 6 Sn 5 including 4.6 mol% In. It have been reported that In is solid-soluted in both β-Sn and Cu 6 Sn 5 phases[7].…”

mentioning

confidence: 99%

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Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar

Hayashi

Shohji

Nakata³

et al. 2016

MSF

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To create a high reliability solder joint using IMCs dispersed in the joint, the joints with four types of lead-free solder were investigated. The joint with Sn-3.0Ag-0.7Cu-5.0In (mass%) has high die shear force compared to other joints investigated, and the joint with the Ni-electroplated Cu bonded at 300 oC for 30 min showed the maximum die shear force due to formation of a large number of fine IMCs. In the joint with Sn-0.7Cu-0.05Ni (mass%), uniform dispersion of a large number of IMCs was achieved, although the die shear force of the joint is lower than that of the joint with Sn-3.0Ag-0.7Cu-5.0In. In the joint with Sn-5.0Sb (mass%), a solder area was remained in the center of the joint although a large number of columnar IMCs form at the joint interface. The die shear force of the joint with Sn-5.0Sb increased with increasing the bonding time due to formation and growth of IMCs. In the joint with Sn-3.0Ag-0.5Cu (mass%), IMCs formed at the joint interface and did not disperse in the entire joint.

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Section: Thermec 2016mentioning

confidence: 92%

Section: Thermec 2016mentioning

confidence: 98%

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Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar

Hayashi

Shohji

Nakata³

et al. 2016

MSF

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“…Cu dissolved from the substrate forms a pillar shaped intermetallic compound (hereinafter referred to as an IMC pillar) in the soldered joint and the IMC pillar can suppress crack growth. On the basis of the quantitative analysis with an electron probe X-ray microanalyzer (EPMA), it was found that the IMC pillar consists of Cu and Sn [4]. The aim of this study is to investigate the formation mechanism of the IMC pillar.…”

Section: Introductionmentioning

confidence: 99%

Formation mechanism of pillar-shaped intermetallic compounds dispersed lead-free solder joint

Nakata

Hashimoto²,

Kurasawa³

et al. 2017

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. Large area joining between a substrate and a heat sink is desirable for high performance power modules. An intermetallic compounds (IMCs) pillar dispersed solder joint has been developed as a highly durable joint to achieve large area joining. The aim of this study is to clarify the generation and growth mechanism of the IMC pillar during soldering process. The structural characteristic of the IMC pillar was also examined by cross-sectional observation. The area ratio of the IMC pillars in the cross section of the joint increased with increasing the joining temperature. The shape of the IMC pillar became finer when the cooling rate was fast. In addition, the IMC pillar grew along the cooling direction.

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Development of high reliability lead-free solder joint dispersed IMC pillar

Abstract: The aim of this study is to create a high reliability solder joint for automotive applications by actively utilizing IMC formation in the joint. The method to disperse pillar-shaped

Cited by 2 publications

References 6 publications

Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar

Effect of Added Elements on Microstructures and Joint Strength of Lead-Free Sn-Based Solder Joint Dispersed IMC Pillar

Formation mechanism of pillar-shaped intermetallic compounds dispersed lead-free solder joint

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