Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards using Copper-Molybdenum Composites

Itô, Yôhei; Takanishi, Kenjiro; Sakamoto, Tatsuya; Fujiwara, Keiichi; Arai, Hiroyuki

doi:10.1299/jsmeted.2021.0014

The Proceedings of the Thermal Engineering Conference

2021

DOI: 10.1299/jsmeted.2021.0014

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Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards using Copper-Molybdenum Composites

Yôhei Itô

Kenjiro Takanishi

Tatsuya Sakamoto

et al.

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Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards using Copper-Molybdenum Composites

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