Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards

Itô, Yôhei; Takanishi, Kenjiro; Sakamoto, Tatsuya; Fujiwara, Keiichi; Arai, Hiroyuki

doi:10.1299/jsmeted.2020.0042

Cited by 1 publication

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“…In modern engineering and technology fields, composite materials are widely used in aerospace, automotive manufacturing, and electronic devices due to their superior mechanical properties and optimized thermal performance [1][2][3][4]. The thermal conductivity of composite materials not only affects the performance of the materials themselves but also directly relates to the thermal stability and energy efficiency of the entire system [5,6].…”

Section: Introductionmentioning

confidence: 99%

Prediction Model of Thermal Conductivity for Composite Materials Based on Non-Equilibrium Thermodynamics

Fan,

2024

IJHT

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With the widespread application of composite materials in various industrial fields, accurate prediction of their thermal conductivity has become crucial. Traditional models, based mainly on equilibrium thermodynamics, fail to adequately describe the thermal behavior of composite materials under non-equilibrium conditions. This paper introduces a novel thermal conductivity prediction model based on non-equilibrium thermodynamics, focusing on entropy production adjustments and thermal conductivity prediction considering entropy production. By thoroughly analyzing the microstructure and interface characteristics of composite materials, this study aims to enhance the accuracy of thermal conductivity predictions and provide theoretical support for efficient thermal management of composite materials. The results indicate that this model effectively predicts the thermal conductivity of composite materials under non-equilibrium conditions, offering high practical value.

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Section: Introductionmentioning

confidence: 99%

Prediction Model of Thermal Conductivity for Composite Materials Based on Non-Equilibrium Thermodynamics

Fan,

2024

IJHT

View full text Add to dashboard Cite

show abstract

Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards

Cited by 1 publication

References 0 publications

Prediction Model of Thermal Conductivity for Composite Materials Based on Non-Equilibrium Thermodynamics

Prediction Model of Thermal Conductivity for Composite Materials Based on Non-Equilibrium Thermodynamics

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