Development of high dielectric polyimides containing bipyridine units for polymer film capacitor

Peng, Xinwen; Xu, Wenhui; Chen, Linlin; Ding, Yichun; Xiong, Tianrou; Chen, Shouhui; Hou, Haoqing

doi:10.1016/j.reactfunctpolym.2016.07.017

Cited by 51 publications

(43 citation statements)

References 31 publications

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“…Introduction of polar groups into molecular structure can improve this parameter, but it would also likely deteriorate the other properties. For example, dielectric constant was enhanced from 2.9 to 4.9 (at 190 °C and 1 kHz) when highly polar nitrile dipoles were attached to the main chains, and to 5.5–7.2 when bipyridine units were brought into backbone of polyimides, while their dissipation factor was increased to a high level of 0.04–0.08 due to the difficulty of frictionless dipole switching . Dielectric constant of 7.8 and maximum energy density of 15 J cm −3 was achieved from polyimides prepared from aromatic dianhydrides and aliphatic diamines with polar groups of O, C(O) in molecular structures, while the heat resistance was sacrificed ( T g = 53–174 °C) owing to the aliphatic moieties .…”

Section: Heat Resistance and Dielectric Properties Of Sulfonyl‐contaimentioning

confidence: 99%

Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance and Dielectric Properties for High‐Temperature Capacitor Applications

Tong

Ahmad

et al. 2019

Macro Materials & Eng

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Polymer dielectrics, with advanced dielectric properties and heat resistance, are critical for high‐temperature capacitors in various applications. However, the high performance of heat resistance and dielectric properties are quite difficult to achieve all together due to their mutual implication. Here, by intensively investigating the correlation between molecular structure and properties, polyimide dielectrics with i) enhanced dielectric constant by introducing sulfonyl group, ii) low dissipation factor by introducing flexible linkage, and iii) high Tg (glass transition temperature) by retaining an aromatic structure, are obtained. The sulfonyl‐containing polyimides with different flexible linkages exhibit simultaneously a high dielectric constant (4.50–5.98), low dissipation factor (0.00298–0.00426), and outstanding breakdown strength (most above 500 MV m−1), as well as superior heat resistance (Tg : 244–304 °C). Specifically, the polyimide (SPI‐1) with sulfonyl group in diamine moiety and para‐para linkage shows stable dielectric properties up to 150 °C, and the discharged energy density and charge–discharge efficiency can be as high as 7.04 J cm−3 and 91.3% at 500 MV m−1, respectively.

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Section: Heat Resistance and Dielectric Properties Of Sulfonyl‐contaimentioning

confidence: 99%

Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance and Dielectric Properties for High‐Temperature Capacitor Applications

Tong

Ahmad

et al. 2019

Macro Materials & Eng

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“…Commonly known high-energy storage dielectric materials are mainly biaxially oriented polypropylene (BOPP), polyester, polycarbonate (PC), polyphenylene disulfide, polyurea, polyurethane, and polyvinylidene fluoride [3]. Among many polymers, polyimide (PI) is a type of polymer containing an imide ring on the main chain [4].…”

Section: Introductionmentioning

confidence: 99%

“…Peng et al [3] used 5,5 0 -bis[(4-amino)phenoxy]-2,2 0 -bipyridine (BPBPA) diamine monomer (as shown in Figure 2) and different dianhydrides [BPDA, PMDA, 3,3 0 ,4,4 0 -Benzophenonetetracarboxylic dianhydride (BTDA), 4,4 0 -Oxydiphthalic anhydride (OPDA)] to give a series of bispyridyl-containing PIs using a two-step synthesis. The bipyridyl unit enhanced the electronic polarization and coupling: The polarized PI had a ε r of ≤7.2, the dielectric loss was ≥0.04, and the energy density was ≤2.77 J cm À3 .…”

Section: Introduction Of Bispyridine Groups In Pi Chainsmentioning

confidence: 99%

High-Temperature Polyimide Dielectric Materials for Energy Storage

Zha¹,

Liu²,

Tian³

et al. 2021

Polyimide for Electronic and Electrical Engineering Applications

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The availability of high-temperature dielectrics is key to develop advanced electronics and power systems that operate under extreme environmental conditions. In the past few years, many improvements have been made and many exciting developments have taken place. However, currently available candidate materials and methods still do not meet the applicable standards. Polyimide (PI) was found to be the preferred choice for high-temperature dielectric films development due to its thermal stability, dielectric properties, and flexibility. However, it has disadvantages such as a relatively low dielectric permittivity. This chapter presents an overview of recent progress on PI dielectric materials for high-temperature capacitive energy storage applications. In this way, a new molecular design of the skeleton structure of PI should be performed to balance size and thermal stability and to optimize energy storage property for high-temperature application. The improved performance can be generated via incorporation of inorganic units into polymers to form organic-inorganic hybrid and composite structures.

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“…The method of introducing polar groups into Additional Supporting Information may be found in the online version of this article. 34,35 Ma et al developed a series of polyimides deriving from aromatic dianhydrides and aliphatic diamines. For instance, with increasing fluorine content in the polyimide repeating unit, the moisture uptake decreased linearly, which was beneficial to stable dielectric property.…”

Section: Introductionmentioning

confidence: 99%

Revealing the correlation between molecular structure and dielectric properties of carbonyl‐containing polyimide dielectrics

Tong

Ahmad

et al. 2019

J of Applied Polymer Sci

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Polymer dielectrics with outstanding heat resistance and advanced dielectric properties are of great importance for hightemperature capacitors in the applications of hostile circumstances. In this work, a series of aromatic carbonyl-containing polyimides (CPI) are prepared from the carbonyl dianhydride and different diamines. The correlation between molecular structure (i.e., different linked structure ( O , CH2 , SO2 ) in diamines, the length of repeating unit and the linked position (para-para or meta-meta), and properties is revealed in detail to obtain CPI dielectrics with excellent thermal resistance (glass transition temperature, T g : 241~352 C), reasonably high dielectric constant (3.99~5.23), low dissipation factor (0.00307~0.00395), and admirable breakdown strength (425~552 MV/m) simultaneously. Particularly, CPI-5 with carbonyl structure in dianhydride and sulfonyl group in diamine proves to exhibit discharged energy density and charge-discharge efficiency of 6.34 J/cm 3 and 92.3% at 500 MV/m, respectively. In addition, CPI-5 also displays stable dielectric properties in temperature range of −50-200 C.

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Development of high dielectric polyimides containing bipyridine units for polymer film capacitor

Cited by 51 publications

References 31 publications

Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance and Dielectric Properties for High‐Temperature Capacitor Applications

Sulfonyl‐Containing Polyimide Dielectrics with Advanced Heat Resistance and Dielectric Properties for High‐Temperature Capacitor Applications

High-Temperature Polyimide Dielectric Materials for Energy Storage

Revealing the correlation between molecular structure and dielectric properties of carbonyl‐containing polyimide dielectrics

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