Development of high conductivity lead (Pb)-free conducting adhesives

Kang, S.K.; Rai, R.; Purushothaman, S.

doi:10.1109/ectc.1996.517444

Cited by 13 publications

(6 citation statements)

References 7 publications

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“…Adhesives have many potential advantages over soldering including: ease of manufacture through increased automation, cost reduction and reduced processing time. There are a number of adhesives which may be used at various steps in display manufacture [1] one of the more novel adhesives is the Z-axis or anisotropic conducting adhesive [2][3][4][5][6]. The Z-axis adhesives are designed to conduct only in one direction making them ideal for adhering flex tails to bus bars on the glass substrates of displays.…”

Section: Introductionmentioning

confidence: 99%

P‐8: Conductive and Adhesive Properties of Z‐axis Adhesives for Tail Bonding

Cairns

Crawford

LaCourse

et al. 2001

Symp Digest of Tech Papers

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The change in resistance of an anisotropic conducting adhesive (Z-axis adhesive) solderless joint with increasing strain in a shear configuration is investigated using a modified mechanical testing machine. No change in resistance is evident up to a load of 25 Newtons above this load the resistance increases rapidly and electrical continuity is lost. We also report on the change in resistance with strain after ageing at 85° C and 85 % Relative humidity for six days. The anisotropic conducting adhesive performs well in shear after ageing.

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Section: Introductionmentioning

confidence: 99%

P‐8: Conductive and Adhesive Properties of Z‐axis Adhesives for Tail Bonding

Cairns

Crawford

LaCourse

et al. 2001

Symp Digest of Tech Papers

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“…With current solder paste technology very fine pitch interconnection become hard to handle due to soldering defects such as bridging and solder balling [15][16][17]. This means to connect the components on the circuit boards under these boundary conditions improved or new interconnection technologies are needed.…”

Section: Introduction and Historical Backgroundmentioning

confidence: 99%

Electrically Conductive Adhesives

Nicolics¹,

Mundlein²

Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Electrically conductive adhesives are being used in electronic packaging for several decades. A brief review of the dynamic development of conductive adhesives under the influence of the miniaturization, the adaptation of environmental friendly manufacturing processes is presented. With respect to the importance of isotropically conductive adhesives (ICA), a new contact model to analyze the principle influences of e.g., particle size, particle geometry, and filler content on the percolation threshold is introduced. With this model the arrangement of the particles within a contact is calculated by considering different types of forces (elastic, friction, adhesion, and inertia). Taking into account the electrical properties of the filler particles, the electrical contact behavior including its changes due to aging is investigated. Finally, typical applications of isotropically conductive adhesives are presented. One example shows how the thermal requirements for attaching a GaAs heterojunction power transistor can be fulfilled using an adhesive with an extremely high filler content (thermal conductivity: >60 W/mK). In another case it is demonstrated how extreme thermomechanical requirements resulting from a thermal expansion mismatch of parts of a sealed IR sensor housing can be corresponded using an adhesive with a comparatively low glass transition temperature. A further example shows a packaging concept of a miniaturized, biocompatible multichip module. For mounting both, narrowly spaced SMDs and bare chips, an isotropically conductive adhesive has been applied. 21

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“…Eliminating lead from electronic packages is underway. [4] Another limitation of solder paste exists in its use for fine pitch components. The current solder paste technology used in surface mount technology (SMT) can not handle this very fine pitch interconnection due to the soldering defects such as bridging or soldering balling.…”

Section: Introductionmentioning

confidence: 99%

“…The current solder paste technology used in surface mount technology (SMT) can not handle this very fine pitch interconnection due to the soldering defects such as bridging or soldering balling. [3][4][5] In the electronic industry, two groups of materials are being investigated at present as possible alternatives for leadcontaining solders: lead-free solders such as Sn/Ag, Sn/Ag/Cu [6,7] and electrically conductive adhesives [8][9][10][11]. However, the melting points of most lead-free metal alloys are 30~40 °C higher than the eutectic tin/lead solder.…”

Section: Introductionmentioning

confidence: 99%

Formation of self assembled monolayer (SAM) on metal surfaces for high performance anisotropically conductive adhesives

Moon

Wong

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745)

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To improve the electrical property of the anisotropically conductive adhesive (ACA) joints, self-assembled monolayer (SAM) compounds are introduced into the interface between the metal filler and the substrate bond pad. The formation of the SAM on various metal surfaces and their thermal stability are investigated by measuring the contact angles of SAM compounds with a hydrophilic or hydrophobic tail groups such as octadecanethiol (ODT) and mercpatoacetic acid (MAA) on Au, Cu, Sn and SnPb surfaces. Goniometer testing and grazing FTIR spectra demonstrate that SAM molecules are readily adhered to metal surfaces. The concentration of SAM solutions, immersing time, thermal treatment temperature and time were varied as experimental parameters. ODT adhered to copper surface the best, while gold was the best metal for MAA. The ODT SAM coatings on the metal surfaces used were thermally stable for 2 hrs at room temperature and 100 °C. However, they were slightly degraded at 150 °C. The MAA SAM coatings on the metal surfaces are unstable at 150 °C and are degraded after 2 hrs at 150 °C. The dithiol SAM compound (1,4-Benzenedithiol) was applied in ACA joints, where conductive fillers (polymer particles coated with gold) and Ni/Au bond pad surfaces were treated with the dithiol SAM compound. Epoxy resins with two different curing temperatures were used as polymer matrices of the ACA formulations, respectively. From the current-voltage (I-V) measurement, it was found that the SAM treated ACA joints showed a lower resistance at the same applied current than nontreated joints.

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Development of high conductivity lead (Pb)-free conducting adhesives

Cited by 13 publications

References 7 publications

P‐8: Conductive and Adhesive Properties of Z‐axis Adhesives for Tail Bonding

P‐8: Conductive and Adhesive Properties of Z‐axis Adhesives for Tail Bonding

Electrically Conductive Adhesives

Formation of self assembled monolayer (SAM) on metal surfaces for high performance anisotropically conductive adhesives

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