Development of Green Insulation Boards from Kenaf Fibres and Polyurethane

Ibraheem, Sameer Adnan; Ali, Aidy; Abdan, Khalina

doi:10.1080/03602559.2010.551379

Cited by 24 publications

(6 citation statements)

References 18 publications

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“…Table 5 compares thermal conductivity values of the insulation boards manufactured with CG1:CA0.66 and CG1:CA1 formulations with other thermal insulation materials. The λ values for insulation boards are close to that of the coconut husk insulation boards, bagasse insulation boards, larch bark insulation boards, kenaf-fiber insulation boards, and corncob particleboards, which have a similar density range [4,8,10,11,29]. In comparison to synthetic materials (e.g., mineral wool, polyethylene foam, and extruded polystyrene foam), the values were higher, although the density values of synthetic materials were lower in comparison to wood fiber insulation boards.…”

Section: Thermal Conductivitysupporting

confidence: 55%

“…Insulation products incorporating natural fibers are available on the market. These products have promising properties in building applications [8]. Asdrubali et al [1] report some building insulation products made of natural unconventional material, which show good thermo-acoustic properties such as reeds, bagasse, cattail, corn cob, cotton, durian, rice, etc.…”

Section: Introductionmentioning

confidence: 99%

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Thermo-Mechanical Properties of a Wood Fiber Insulation Board Using a Bio-Based Adhesive as a Binder

et al. 2020

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The goal of the present study was to develop a low-density thermal insulation board using wood fibers and a bio-based adhesive as a binder, which was prepared from a crude glycerol and citric acid mixture. The physical and mechanical properties of insulation boards manufactured using two ratios of crude glycerol and citric acid (1:0.66 and 1:1 mol/mol) and two adhesive contents (14% and 20%) were evaluated. The results show that the insulation boards with a range of density between 332 to 338 kg m−3 present thermal conductivity values between 0.064 W/m-K and 0.066 W/m-K. The effect of adhesive content was very significant for certain mechanical properties (tensile strength perpendicular to surface and compressive strength). The tensile strength (internal bond) increased between 20% and 36% with the increased adhesive content. In contrast, the compressive strength decreased between 7% and 15%. The thermo-mechanical properties obtained of insulation boards such as thermal conductivity, traverse strength, tensile strength parallel and perpendicular to surface, and compressive strength are in accordance with the requirements of the American Society for Testing and Materials C208-12 standard for different uses. The results confirm the potential of crude glycerol and citric acid mixture to be used as an adhesive in the wood fiber insulation boards’ manufacturing for sustainability purposes.

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Section: Thermal Conductivitysupporting

confidence: 55%

Section: Introductionmentioning

confidence: 99%

Thermo-Mechanical Properties of a Wood Fiber Insulation Board Using a Bio-Based Adhesive as a Binder

et al. 2020

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“…Advantages of natural fibres over glass fibres include low cost, low density, resistance to breakage during processing, high strength-to-weight ratio, low energy content and recyclability. 10,11 Oil palm empty fruit bunch fibres (EFBs) are available in abundance, in addition to being renewable, nontoxic, and less costly. 12 In Malaysia, the palm oil industry is a major producer and exporter.…”

Section: Introductionmentioning

confidence: 99%

Tensile and Thermal Properties of Crosslinked Chitosan/Empty Fruit Bunch Biofilms by Phthalic Anhydride

Chan¹,

Husseinsyah²,

Amirudin³

2016

JPS

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Chitosan (CS) has high potential applications in packaging, agriculture and food. However, the cost associated with CS application is high. Therefore, the addition of agriculture waste such as empty fruit bunch (EFB) in CS has been studied in order to reduce the cost of CS. The CS/EFB biofilms are prepared through solvent casting method. This paper studies the effect of phthalic anhydride (PA) crosslinking agent on tensile, morphological and thermal properties of CS/EFB biofilms. The results indicated that the tensile strength and elongation at break of uncrosslinked CS/EFB biofilms decreases. However, the modulus of elasticity increases with the increasing EFB content. In addition, the glass transition temperature (T g) of CS/EFB biofilms increased with EFB content. The crosslinked CS/EFB biofilm with PA showed higher tensile properties (i.e., tensile strength, elongation at break and modulus of elasticity) in comparison with uncrosslinked biofilms. The T g of crosslinked CS/EFB biofilms, meanwhile, was higher than the uncrosslinked biofilms due to formation of amide linkages. The formation of amide bonds between CS and PA was analysed using the Fourier transform infrared (FTIR) spectroscopy. The better filler dispersion and filler-matrix adhesion were proven by scanning electron microscopy (SEM). It was further observed that the percentage gel fraction of both uncrosslinked and crosslinked CS/EFB biofilms increased with increasing of EFB content. On the other hand, the crosslinked CS/EFB biofilms exhibited higher gel fraction than uncrosslinked biofilms due to the formation of amide crosslinkages in crosslinked biofilms.

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“…4 Various applications had been explored to utilize the use of kenaf fiber (KF) including as adsorbent material, feed stock, insulation board, paper and as reinforcement in polymer composites. [5][6][7][8][9] However, certain drawback of natural fibers/polymers composites is the incompatibility between the hydrophilic natural fibers and the hydrophobic polymer matrices. This leads to undesirable properties to the composites.…”

Section: Introductionmentioning

confidence: 99%

Hybrid composites of short acetylated kenaf bast fiber and conducting polyaniline nanowires in epoxy resin

Razak

Rahman

Yahya

2013

Journal of Composite Materials

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This article reports the preparation and characterization of newly developed hybrid composites consisting of epoxy resin (EP) matrix, acetylated kenaf bast fiber (AKF) and conducting polyaniline (PANI) nanowires. Initially, the EP/AKF composites were prepared by varying the AKF loading (5–30 wt%). The EP/AKF displayed an optimum tensile strength at 20 wt% AKF loading which was higher than that of untreated kenaf fiber EP composites (EP/UKF). The hybrid composites of EP/AKF/PANI were then prepared by using 20 wt% AKF loading with PANI inclusions from 2 to 14 wt%. The addition of PANI into EP/AKF induced positive electrical properties without considerably sacrificing its mechanical integrity. It was found that the electrical percolation threshold of these hybrid composites was at 11 wt% of PANI loading. PANI inclusions at above the percolation loading resulted in reduction of tensile and flexural strength. Meanwhile, no significant mechanical loss was observed below the threshold. The fracture morphological analysis revealed the occurrences of PANI nanowires pull out from the matrix. The Fourier transform infrared spectroscopy showed that the PANI component still maintained its doped condition inside the EP/20AKF. Water absorption and thermal analysis indicate that the PANI incorporation induced lower water uptakes and greater thermal stability to the EP/20AKF, respectively.

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Development of Green Insulation Boards from Kenaf Fibres and Polyurethane

Cited by 24 publications

References 18 publications

Thermo-Mechanical Properties of a Wood Fiber Insulation Board Using a Bio-Based Adhesive as a Binder

Thermo-Mechanical Properties of a Wood Fiber Insulation Board Using a Bio-Based Adhesive as a Binder

Tensile and Thermal Properties of Crosslinked Chitosan/Empty Fruit Bunch Biofilms by Phthalic Anhydride

Hybrid composites of short acetylated kenaf bast fiber and conducting polyaniline nanowires in epoxy resin

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