2010
DOI: 10.1016/j.physc.2010.05.091
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Development of buffer layers on 30mm wide textured metal substrates for REBCO coated conductors

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Cited by 6 publications
(2 citation statements)
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“…At industrial scale the preferred solution deposition techniques are slot die coating or dip coating, although IJP has also been demonstrated and several different metallic substrates have been used, i.e. RABiT, IBAD and copper clad [29,30,146,167,172,[309][310][311]. The specific adaptation of composition to reach controlled rheological properties of the solutions have been widely implemented at the industrial scale to minimize the number of depositions.…”
Section: Scaling Of CC Manufacturingmentioning
confidence: 99%
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“…At industrial scale the preferred solution deposition techniques are slot die coating or dip coating, although IJP has also been demonstrated and several different metallic substrates have been used, i.e. RABiT, IBAD and copper clad [29,30,146,167,172,[309][310][311]. The specific adaptation of composition to reach controlled rheological properties of the solutions have been widely implemented at the industrial scale to minimize the number of depositions.…”
Section: Scaling Of CC Manufacturingmentioning
confidence: 99%
“…Additionally, these manufacturing systems may run continuously in an automatic mode with quite conventional low temperature (300 • C-500 • C) furnaces working at normal pressures and so they are not considered to be a relevant production barrier neither a cost limiter at present. This step could also be very easily extended to wider metallic substrates [310]. In conclusion, all the specific common steps related to the CSD approach have been widely implemented using non-vacuum technologies.…”
Section: Scaling Of CC Manufacturingmentioning
confidence: 99%