Nanostructured Thin Films X 2017
DOI: 10.1117/12.2270472
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Development of batch producible hot embossing 3D nanostructured surface-enhanced Raman scattering chip technology

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“…In this work, we developed a batch producible hot embossing 3D nanostructured SERS chip with low cost and good reproducibility. [6] We utilized the AAO self-assembled uniform nanohemispherical array barrier layer as a template for electroforming a durable nanostructured nickel mold. With the hot embossing technique and the durable nanostructured nickel mold, we were able to mass-produce the 3D nanostructured polycarbonate (PC) substrates with consistent quality.…”
Section: Introductionmentioning
confidence: 99%
“…In this work, we developed a batch producible hot embossing 3D nanostructured SERS chip with low cost and good reproducibility. [6] We utilized the AAO self-assembled uniform nanohemispherical array barrier layer as a template for electroforming a durable nanostructured nickel mold. With the hot embossing technique and the durable nanostructured nickel mold, we were able to mass-produce the 3D nanostructured polycarbonate (PC) substrates with consistent quality.…”
Section: Introductionmentioning
confidence: 99%