Abstract:In recent years, it is strongly required to improve the Chemical Mechanical Polishing (CMP) technology for Cu. The conventional Cu-CMP slurries, however, have serious problems relating to detrimental impact on environment, because it includes a lot of organic compounds and abrasives. In this study, a new Cu-CMP method, that is, the polishing method utilizing vacuum ultraviolet (VUV) light irradiation and an electrolyzed water was proposed and developed in order to overcome the above-mentioned problem. In the n… Show more
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