Development of a Two-Chamber Process for Self-Assembling a Fluorooctatrichlorosilane Monolayer for the Nanoimprinting of Full-Track Nanopatterns with a 35 nm Half Pitch

Abstract

The technology of depositing a uniform and stable anti-adhesion layer on a wafer-scale nanostamp is a critical issue in the industrialized nanoimprinting process. The deposition of an anti-adhesion layer involves O2 plasma treatment to modify the stamp surface and the reaction of the monomers with the surface. Although an automated one-chamber system was developed for uniform and stable anti-adhesion layer coating, unwanted molecules are irregularly deposited on a sample during the O2 plasma treatment due to the contamination of the chamber, leading to the degradation of the anti-adhesion properties. In this paper, a two-chamber self-assembled monolayer (SAM) deposition system was proposed to prevent the degradation of the anti-adhesion properties due to contamination. To examine the effectiveness of the proposed system, the contact angles and chemical compositions of the SAM-coated silicon mold prepared using the one- and two-chamber systems were measured and compared. Finally, 4-in nanoimprinting of 35-nm-half-pitch full-track nanopatterns was conducted using a SAM-coated silicon nanomold prepared using the one- and two-chamber systems, and the replication quality was examined.