Development of a Transient Thermal Analysis Model for Engine Mounts

El-Sharkawy, Alaa; Uddin, Ahmed

doi:10.4271/2016-01-0192

Cited by 4 publications

(2 citation statements)

References 9 publications

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“…For quantitative analysis and calculations, the Minitab and JMP software were used complementarily. The rework-induced thermal management results were analyzed; the peak temperature variance, bar chart on quantity solder joints affected, and variability chart for dye and pull test results were generated 34 .…”

Section: Methodsmentioning

confidence: 99%

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Ismail

Bakar

Ehsan

et al. 2022

Sci Rep

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This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.

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Section: Methodsmentioning

confidence: 99%

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Ismail

Bakar

Ehsan

et al. 2022

Sci Rep

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“…It absorbs the engine vibrations and road shocks to dampen the noise and vibration for comfort. It is sensitive to temperature [1] hence the life span and performance of an engine mount affected by different temperatures acting on it. However, the change in mounting criteria is highly contributed by the elastomeric component inside the mount [2].…”

Section: Introductionmentioning

confidence: 99%

Tensile Properties Degradation of Thermally Aged NR/EPDM Blend and Nanocomposites for Engine Mounting

Karim¹,

Mohamad²,

Lin³

et al. 2020

MJCSM

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Nowadays, NR/EPDM have drawn great attention to most researchers to be utilized in an engine mounting. In service, majority of structures and components are subjected to service condition such as heat, liquids and stress of dynamic loading. This research is an effort to compare the thermal effects on physical and mechanical properties of NR/EPDM blend and NR/EPDM filled graphene nanoplatelets (GNPs) for the potential usage in the engine mounting. The blends and nanocomposites were prepared through a melt compounding using a Banbury Internal Mixer, exposed to thermal cycles and tensile tested. The materials were heated alternately for 10 minutes at 60℃ and 120℃ for 0, 35, 70 and 150 cycles. Thermally aged NR/EPDM nanocomposites showed higher performance under tensile stress if compared to NR/EPDM blend. The tensile strength and elastic modulus were consistently 40% higher than the strength of the blend. This is due to the reinforcing effects of GNPs and their good interaction with the matrix. The reduction of tensile properties was due to the embrittlement effect and in line with the increase in amorphous phases from the broadening of XRD spectra. This has proven that the NR/EPDM nanocomposites can withstand thermal cycles, oils and fluctuating stress better than NR/EPDM blend and exhibited higher potential to be utilized as the engine mount material.

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Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering

Ismail

Bakar

Ehsan

et al. 2023

Springer Proceedings in Physics

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Development of a Transient Thermal Analysis Model for Engine Mounts

Cited by 4 publications

References 9 publications

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

Tensile Properties Degradation of Thermally Aged NR/EPDM Blend and Nanocomposites for Engine Mounting

Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering

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