Development of a piezotranslator-based bending device for in situ SEM investigations of high performance ceramics

Frei, Hanspeter; Grathwohl, G.

doi:10.1088/0022-3735/22/8/011

Cited by 12 publications

(4 citation statements)

References 3 publications

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“…Wiklund et al [14], Frei et al [15], and Buchanan et al [16] already performed in-situ, 4-point bending tests in a scanning electron microscope (SEM), which enabled them to examine crack propagation phenomena at the microscopic level. For the here-presented bending setup, insitu SEM observation of pure bending failure is also an important requirement, as it will greatly enhance the possibilities to unravel the underlying physical origin of the bending failure.…”

Section: Design Considerations and Criteriamentioning

confidence: 99%

A Small-Scale, Contactless, Pure Bending Device for In-situ Testing

2015

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The introduction of flexible electronics calls for new ways of measuring the mechanical limits and failure mechanisms resulting from (large) bending loads during manufacturing and application. Therefore, an autonomous, miniaturized, pure bending test apparatus was developed to investigate material systems at the microscopic level. Improvements to conventional bending test methods are: (1) well-defined pure moment application without friction or local pressure contacts, through active feedback control of parasitic axial and transverse forces at the specimen edges, (2) continuous reversibility of the loading direction within an angular range of −114 • ≤ θ ≤ 114 • (minimum radius of 2 mm), (3) no view-obstruction from both the thickness and in-plane perspective, enabling in-situ optical and scanning electron microscopic studies of failure mechanisms under constant field-of-view. The pure bending test setup was validated by moment-curvature measurements of monocrystalline silicon. The setup's continuous load-reversibility and strain determination were validated by cyclic tests and in-situ digital image correlation, respectively, on polyethylene napthalate specimens. Furthermore, in-situ microscopic failure analysis was demonstrated on

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Section: Design Considerations and Criteriamentioning

confidence: 99%

A Small-Scale, Contactless, Pure Bending Device for In-situ Testing

2015

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“…Kolluri et al [7] reports an example of the relevance of such an investigation with a miniaturized mixed-mode delamination setup, with which quantitative delamination characteristics can be measured while simultaneously the delamination mechanisms can be observed during real-time in situ SEM visualization. Wiklund et al [8], Frei et al [9] and Buchanan et al [10] already performed in situ bending tests in a SEM, relying on the four-point bending principle. Crack propagation due to bending was examined by all of them at the microscopic level.…”

Section: Requirements Of the Bending Testmentioning

confidence: 99%

“…The entire setup is positioned on top of another linear actuator to keep the region of interest in the field-of-view. The movement of this field-of-view stage represents the y-movement as described by equation (9). Figure 5 shows the implementation of the two …”

Section: Setup Kinematicsmentioning

confidence: 99%

A miniaturized contactless pure-bending device for in-situ SEM failure analysis

Hoefnagels

Buizer

Geers

2011

Experimental and Applied Mechanics, Volume 6

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“…In-situ SEM test techniques, which combine quantitative testing and high resolution imaging, extend the capability of SEM and open a new gate to the micro/nano-world. In the past three decades, there have been a lot of reports on the in-situ test techniques of SEM, such as tension/compression [1][2][3], micro/nano-indentation [4,5] and bending tests [6][7][8][9]. However, little was focused on the torsion test of micro-wires in SEM.…”

Section: Introductionmentioning

confidence: 99%

Development of in-situ SEM torsion tester for microscale materials

et al. 2019

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An in-situ SEM (scanning electron microscope) micro-torsion tester with high resolution is developed based on electromagnetism. The torque is controlled and measured using a coil-magnet component. The torsion angle is measured by a non-contact transducer based on Hall-effect. The calibration results show that the torque capacity of this tester is 1.6×10-4 Nm with resolution of 1×10-9 Nm. In-situ torsion test of MG (metallic glass) wire (Pd 40 Cu 30 Ni 10 P 20) with a diameter of 111 µm and a length of 3 mm is performed using this tester in SEM. A linear torque-torsion angle curve is obtained and the calculated shear modulus of the sample is 24.7 GPa. Meanwhile, the deformation process of the sample is simultaneously observed using SEM. It is the first time that the measurement of shear stress-strain and high resolution morphology observation are carried out simultaneously.

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Development of a piezotranslator-based bending device for in situ SEM investigations of high performance ceramics

Cited by 12 publications

References 3 publications

A Small-Scale, Contactless, Pure Bending Device for In-situ Testing

A Small-Scale, Contactless, Pure Bending Device for In-situ Testing

A miniaturized contactless pure-bending device for in-situ SEM failure analysis

Development of in-situ SEM torsion tester for microscale materials

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