Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis

Venkatesh, V.C.; Izman, S.

doi:10.1016/j.jmatprotec.2006.03.139

Cited by 10 publications

(5 citation statements)

References 4 publications

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“…Excellent surface quality is desirable for fault diagnosis by the manufacturers of the IC chips [9]. The surface quality can be improved by the formation of large amounts of ductile streaks on ground silicon surfaces thereby reducing the polishing time.…”

Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

“…Since the average surface roughness (R a ) is the most commonly used and large amounts of ductile streaks favor low surface roughness [16], R a and the smaller-the-better characteristic were selected in this study. This study also chose depths of cut, feed rates and spindle speeds as grinding parameters as were the case with previous work [8,9,10,17]. These parameters were set at three levels as shown in Table 1 The levels for the spindle speed were based on the workable range as specified by the manufacturer of the NSK Planet 850.…”

Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

“…These parameters were set at three levels as shown in Table 1 The levels for the spindle speed were based on the workable range as specified by the manufacturer of the NSK Planet 850. The levels for feed rates and depths of cut were selected based on the previous reported data of the authors [8,9,10]. An L 9 (3 4 ) OA was finally chosen for the experiments.…”

Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

“…Precision grinding can be used for this purpose by proper selection of grinding parameters. Researchers [7,8,9,10] have machined hard-brittle materials paying considerable attention to the generation of massive ductile surfaces while little attention has been paid to the optimization of the precision grinding process. In order to get good surface quality on ground silicon surfaces, it becomes necessary to employ optimization techniques to find optimal grinding conditions that favour low surface roughness and massive ductile surfaces.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of Precision Grinding Parameters of Silicon for Surface Roughness Based on Taguchi Method

Alao

Konneh

2011

AMR

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Silicon being a typical hard-brittle material is difficult to machine to a good surface finish. Although ductile-mode machining (DMM) is often employed to machine this advanced material but this technique requires the use of expensive ultra-precision machine tools therefore limiting its applicability. However, by proper selection of grinding parameters, precision grinding which can be performed on conventional machine tools can be used to generate massive ductile surfaces thereby reducing the polishing time and improving the surface quality. Precision grinding should be planned with reliability in advance and the process has to be performed with high rates of reproducibility. Therefore, this study investigated the effect and optimization of grinding parameters using Taguchi optimization technique during precision grinding of silicon. Experimental studies were conducted under varying depths of cut, feed rates and spindle speeds. An orthogonal array (OA), signal-to-noise (S/N) ratio and the analysis of variance (ANOVA) were employed to find the minimum surface roughness value and to analyze the effect of the grinding parameters on the surface roughness. Confirmation tests were carried out in order to illustrate the effectiveness of the Taguchi method. The results show that feed rate mostly affected the surface roughness. The predicted roughness (Ra) of 34 nm was in agreement with the confirmation tests. Massive ductilestreaked surface was also found corresponding to the minimal surface finish determined from the optimal levels.

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Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

Section: Advances In Materials and Processing Technologies IImentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Optimization of Precision Grinding Parameters of Silicon for Surface Roughness Based on Taguchi Method

Alao

Konneh

2011

AMR

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“…It is well known that ultra precision grinding of the optical parts is able to be realized by using the fine grained diamond wheels [4][5][6][7][8]. However, these wheels exhibit high wheel wear rate due to the recurrent dressing and grinding process, which increases the machining cost for the optical glass.…”

Section: Introductionmentioning

confidence: 99%

ELID Assisted Grinding of Optical Glass with Fine and Coarse Grained Copper-Resin Bonded Diamond Wheels

Zhao

Chen

2009

AMR

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In this paper, a copper-resin bonded diamond wheel was applied to machine the optical glass on a precision grinder. The process of truing and pre-dressing with ELID (electrolytic in-process dressing) were first carried out for the grinding wheels, then the ELID assisted grinding experiments were conducted with the special fine and coarse grained diamond wheels. The experimental results show that the fine and coarse grained wheels can all generated the smooth surface with the surface roughness in nanometer scale and the coarse grained diamond wheel correlates to the slightly more surface damage than the fine grained diamond wheel, which also proves that the high efficient grinding of the optical glass with a good surface quality can be realized with the coarse grained copper-resin wheel on a precision grinder and the grinding wheels were all well conditioned with the conditioning method presented in this paper.

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Recent developments in grinding of advanced materials

Zhong

Venkatesh

2008

Int J Adv Manuf Technol

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Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis

Cited by 10 publications

References 4 publications

Optimization of Precision Grinding Parameters of Silicon for Surface Roughness Based on Taguchi Method

Optimization of Precision Grinding Parameters of Silicon for Surface Roughness Based on Taguchi Method

ELID Assisted Grinding of Optical Glass with Fine and Coarse Grained Copper-Resin Bonded Diamond Wheels

Recent developments in grinding of advanced materials

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